Patterns of electrically conducting polymers and their application as electrodes or electrical contacts

Abstract

Electronic devices having patterned electrically conductive polymers providing electrical connection thereto and methods of fabrication thereof are described. Liquid crystal display cells are described having at least one of the electrodes providing a bias across the liquid crystal material formed from a patterned electrically conductive polymer. Thin film transistors having patterned electrically conductive polymers as source drain and gate electrodes are described. Light emitting diodes having anode and coated regions formed from patterned electrically conductive polymers are described. Methods of patterning using a resist mask; patterning using a patterned metal layer, patterning the metal layer using a resist; and patterning the electrically conductive polymer directly to form electrodes and anode and cathode regions are described.

1 - 79 . (canceled)  
     
     
         80 . A method comprising: 
 providing a substrate having a layer of an electrically conductive polymer material;    disposing on said layer of electrically conductive polymer material a layer of energy sensitive material;    exposing said resist to a pattern of energy to form a pattern in said layer of energy sensitive material;    developing said pattern forming a pattern in said layer resulting in exposed and unexposed regions of said electrically conductive polymer;    removing said electrically conductive polymer in said exposed regions;    removing said resist leaving a pattern of said electrically conductive polymer on said substrate.    
     
     
         81 . A method according to  claim 80  wherein said electrically conductive polymer is selected from the group consisting of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes combinations thereof and blends thereof with other polymers and copolymers of the monomers thereof.  
     
     
         82 . A method according to  claim 80  wherein said energy is selected from the group consisting of electromagnetic radiation, heat and a particle beam.  
     
     
         83 . A method according to  claim 80  wherein said developing is done by removing regions of said resist exposed to said energy.  
     
     
         84 . A method according to  claim 90  wherein said developing is done by removing regions of said resist not exposed to said energy.  
     
     
         85 . A method according to  claim 83  wherein said removing is done by chemically dissolving.  
     
     
         86 . A method according to  claim 94  wherein said removing is done by chemically dissolving.  
     
     
         87 . A method according to  claim 80  wherein said removing is done by reaction ion etching.  
     
     
         88 . A method comprising: 
 providing a substrate having a layer of electrically conductive polymer material;    depositing a pattern of a metal layer through a metal mask forming a patterned metal layer on said layer of electrically conductive polymer,    forming regions covered by said metal pattern and exposed regions of said electrically conductive polymer;    etching said exposed regions to remove said exposed regions;    removing said metal.    
     
     
         89 . A method according to  claim 88  wherein said electrically conductive polymer is selected from the group consisting of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes combinations thereof and blends thereof with other polymers and copolymers of the monomers thereof.  
     
     
         90 . A method according to  claim 89  wherein said mask is a molybdenum mask and said metal is platinum.  
     
     
         91 . A method according to  claim 89  wherein said etching is reactive ion etching.  
     
     
         92 . A method according to  claim 89  wherein said exposed regions are removed with acid.  
     
     
         93 . A method comprising: 
 providing a substrate having a layer of an electrically conductive polymer;    disposing a layer of metal on said layer of electrically conductive polymer;    disposing an energy sensitive material on said metal layer;    exposing said energy sensitive material to a pattern of radiation;    developing said pattern forming a pattern in said energy sensitive material resulting in exposed and unexposed regions of said metal layer;    removing said metal layer in said exposed regions,    resulting in exposed and unexposed regions of said electrically conductive polymer;    removing said exposed regions of said electrically conductive polymer;    removing said energy sensitive material;    removing the remaining portions of said metal layer.    
     
     
         94 . A method according to  claim 93  wherein said electrically conductive polymer is selected from the group consisting of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes combinations thereof and blends thereof with other polymers and copolymers of the monomers thereof.  
     
     
         95 . A method according to  claim 93  wherein said metal layer is selected from the group consisting of Al.  
     
     
         96 . A method according to  claim 93  wherein said radiation is electromagnetic radiation.  
     
     
         97 . A method according to  claim 93  wherein removing said metal layer in said exposed regions is by acid etch.  
     
     
         98 . A method according to  claim 93  wherein said removing of said electrically conductive polymer in said exposed regions is by reactive ion etching.  
     
     
         99 . A method according to  claim 93  wherein removing remaining portions of said metal layer is with an acid etchant.  
     
     
         100 . A method comprising: providing a substrate having a layer of an electrically conductive polymer material; said electrically conductive polymer contains energy sensitive agents; exposing said electrically conductive polymer to a pattern of energy forming a pattern of unexposed regions; removing said electrically conductive polymer in one of said exposed and unexposed regions to form a pattern of said electrically conductive polymer on said substrate.  
     
     
         101 . A method according to  claim 100  wherein said electrically conductive polymer is selected from the group consisting of one or more of substituted and unsubstituted polyparaphenylene vinylenes, polyparaphenylenes, polyanilines, polythiophenes, polyazines, polyfuranes, polypyrroles, polyselenophenes, poly-p-phenylene sulfides, polyacetylenes combinations thereof and blends thereof with other polymers and copolymers of the monomers thereof.  
     
     
         102 . A method according to  claim 100  wherein said energy is selected from the group consisting of electromagnetic radiation, heat and a particle beam  
     
     
         103 . A method according to  claim 100  wherein said developing is done by removing regions of said resist exposed to said energy.  
     
     
         104 . A method according to  claim 100  wherein said developing is done by removing regions of said resist not exposed to said energy.  
     
     
         105 . A method according to  claim 103  wherein said removing is done by chemically dissolving.  
     
     
         106 . A method according to  claim 104  wherein said removing is done by chemically dissolving.  
     
     
         107 . A method according to  claim 100  wherein said removing is done by reaction ion etching.  
     
     
         108 . A method according to  claim 100  wherein said energy sensitive agents are constituents of said electrically conductive polymer.  
     
     
         109 . A method according to  claim 100  wherein said energy sensitive agents are additives to electrically conductive polymer.  
     
     
         110 . A method according to  claim 108  wherein said electrically conductive polymer comprises a precursor to an electrically conductive polymer and a dopant.  
     
     
         111 . A method according to  claim 110  wherein said constituents are on said precursor.  
     
     
         112 . A method according to  claim 110  wherein said constituents arc on said dopants.  
     
     
         112 - 121 . (canceled)  
     
     
         122 . A method comprising: 
 providing an electronic device having an electrically active region;    forming an electrical contact to said electrically active region by patterning an electrically conductive polymer.    
     
     
         123 - 131 . (canceled)