US2006249229A1PendingUtilityA1

Metal layer forming methods and capacitor electrode forming methods

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Assignee: MARSH EUGENE PPriority: Apr 25, 2002Filed: Jul 12, 2006Published: Nov 9, 2006
Est. expiryApr 25, 2022(expired)· nominal 20-yr term from priority
Inventors:Eugene P. Marsh
H10D 1/716H10D 1/042H10D 1/694C23C 26/00C23C 16/18C23C 8/10C23C 16/45553H10B 12/0387
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Claims

Abstract

A capacitor electrode forming method includes chemisorbing a layer of at least one metal precursor at least one monolayer thick on a substrate, the layer including non-metal components from the precursor. The chemisorbed layer can be treated with an oxidant and the non-metal components removed to form a treated layer of metal. A capacitor electrode can be formed including the treated layer and, optionally, additional treated layers. Preferably, treating the layer does not substantially oxidize the metal and the treated layers exhibit the property of inhibiting oxygen diffusion. The chemisorbing and the treating can be performed at a temperature below about 450° C. or preferably below about 350° C.

Claims

exact text as granted — not AI-modified
1 - 33 . (canceled)  
     
     
         34 . A capacitor electrode forming method comprising: 
 chemisorbing a layer of at least one metal precursor at least one monolayer thick on a substrate, the layer comprising non-metal components from the precursor;    treating the chemisorbed layer at a temperature of between 100 and 190° C. with an oxidant effective to remove the non-metal components to form a treated layer consisting essentially of metal;    sufficiently repeating the chemisorbing, the treating, and the removing to form at least one additional treated layer consisting essentially of metal on the treated layer; and    forming a capacitor electrode consisting of the treated layers.    
     
     
         35 . The method of  claim 34  wherein the non-metal components comprise organic components.  
     
     
         36 . The method of  claim 34  wherein the oxidant comprises O 3 .  
     
     
         37 . The method of  claim 34  wherein treating the layer does not substantially oxidize the metal.  
     
     
         38 . The method of  claim 34  wherein both the chemisorbing and the treating are performed at a temperature between 100 and 190° C.  
     
     
         39 . The method of  claim 34  wherein the treated layers exhibit the property of inhibiting oxygen diffusion to a greater extent than would another layer of same composition and thickness formed without the chemisorbing.  
     
     
         40 . The method of  claim 34  wherein the capacitor electrode consists of a bottom electrode and the substrate comprises insulative material.  
     
     
         41 . The method of  claim 34  wherein the treating occurs after purging excess metal precursor that is not chemisorbed and without mixing the metal precursor and the oxidant.

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