Semiconductor processing methods of forming contact openings, methods of forming electrical connections and interconnections, and integrated circuitry

Abstract

Methods of forming contact openings, making electrical interconnections, and related integrated circuitry are described. Integrated circuitry formed through one or more of the inventive methodologies is also described. In one implementation, a conductive runner or line having a contact pad with which electrical communication is desired is formed over a substrate outer surface. A conductive plug is formed laterally proximate the contact pad and together therewith defines an effectively widened contact pad. Conductive material is formed within a contact opening which is received within insulative material over the effectively widened contact pad. In a preferred implementation, a pair of conductive plugs are formed on either side of the contact pad laterally proximate thereof. The conductive plug(s) can extend away from the substrate outer surface a distance which is greater or less than a conductive line height of a conductive line adjacent which the plug is formed. In the former instance and in accordance with one aspect, such plug(s) can include a portion which overlaps with the contact pad of the associated conductive line.

1 - 51 . (canceled)  
   
   
       52 . Integrated circuitry comprising: 
 a semiconductive substrate having an outer surface;    a conductive line disposed over the outer surface and having a conductive portion which defines a contact pad with which electrical connection is desired;    at least one conductive plug disposed laterally proximate the contact pad and having a plug portion disposed elevationally over a portion of the contact pad; and    conductive material disposed over the contact pad and in electrical communication with at least a portion of the conductive plug.    
   
   
       53 . Integrated circuitry comprising: 
 a semiconductive substrate having an outer surface;    a conductive line disposed over the outer surface and having a first line width at one location and a second line width which is different from the first line width at another location; at least a portion of the second line width defining a contact pad with which electrical connection is desired;    a conductive plug disposed laterally proximate the contact pad and defining therewith an effective contact pad having an effective contact pad width which is greater than the second line width; and    conductive material disposed over the effective contact pad and making electrical connection with at least a portion of the conductive plug.    
   
   
       54 . Integrated circuitry comprising: 
 a semiconductive substrate having an outer surface;    a conductive line disposed over the outer surface and having a conductive line width and a target area with which electrical communication is desired;    a pair of conductive plugs disposed over the outer surface on either side of the conductive line laterally proximate the target area and self-aligned to the substrate adjacent the conductive line, the plugs and target area defining an effectively widened target area; and    conductive material disposed over and in electrical communication with at least a portion of the effectively widened target area which includes the conductive line target area.