Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation

Abstract

A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different conditioning treatments to different portions of the glazed pad. The conditioning device may have roller segments that rotate at different speeds. Alternatively, the device may have non-cylindrical rollers that provide different rotational speeds at the pad surface, or the device may apply different pressures at different portions of the pad. The device may be arranged to provide uniform conditioning across the width of the pad. The invention is applicable to methods of planarizing semiconductor wafers. The invention may be used to condition circular pads in addition to web-shaped pads. The conditioning device may be adjusted or controlled in response to surface characteristics data obtained by measuring polished wafers.

1 - 49 . (canceled)  
   
   
       50 . A conditioning system, comprising: 
 a support device for supporting a polishing pad;    a rotatable conditioning device for conditioning the surface of the polishing pad; and    an inflatable device for selectively controlling the pressures between portions of said conditioning device and respective portions of the polishing pad.    
   
   
       51 . The conditioning system of  claim 50 , further comprising a flexible low friction bearing material for applying pressure to the polishing pad, the polishing pad being located between said conditioning device and said flexible material.  
   
   
       52 . The conditioning system of  claim 51 , wherein said conditioning device includes a roller.  
   
   
       53 . The conditioning system of  claim 50 , wherein said inflatable device includes an inflatable roller, and wherein the polishing pad is located between said conditioning device and said inflatable roller.  
   
   
       54 . The conditioning system of  claim 50 , further comprising feedback means for adjusting the pressures applied to the polishing pad, wherein said feedback means includes a measurement device for measuring the polishing pad and means for adjusting the conditioning device accordingly.  
   
   
       55 - 65 . (canceled)