Breakable interconnects and structures formed thereby

Abstract

Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect structure, removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and then attaching a second substrate to the anisotropic conductive layer.

1 . A method comprising; 
 placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate;    applying pressure to contact the at least one compliant conductive sphere to the at least one interconnect structure;    removing a portion of the anisotropic conductive layer to expose at least one of the compliant conductive spheres; and    attaching a second substrate to the anisotropic conductive layer.    
     
     
         2 . The method of  claim 1  wherein applying pressure to contact the at least one compliant conductive sphere to the at least one interconnect structure further comprises applying heat to melt the anisotropic conductive layer.  
     
     
         3 . The method of  claim 2  further comprising solidifying the anisotropic conductive layer by at least one of thermal cooling and curing.  
     
     
         4 . The method of  claim 1  wherein the at least one compliant conductive sphere comprises a coating selected from the group consisting of nickel, gold, platinum and paladium and combinations thereof.  
     
     
         5 . The method of  claim 1  wherein the at least one compliant conductive sphere comprises a matrix comprising at least one of epoxy, silicone, polyurethane and combinations thereof.  
     
     
         6 . The method of  claim 1  wherein the anisotropic conductive layer comprises the at least one compliant conductive sphere dispersed within a polymeric matrix.  
     
     
         7 . The method of  claim 6  wherein the polymeric matrix comprises at least one of polyurethane, polystyrene copolymer, and polyolefins, silicone, polyurethane, epoxy silicone and combinations thereof.  
     
     
         8 . The method of  claim 1  wherein attaching a second substrate to the anisotropic conductive layer comprises contacting at least one interconnect structure disposed on the second substrate to at least one of the exposed compliant conductive spheres.  
     
     
         9 . The method of  claim 1  further comprising attaching a clamp structure on the first substrate and the second substrate that is capable of applying pressure to clamp the first substrate and the second substrate together.  
     
     
         10 . The method of  claim 9  wherein the clamp structure is capable of providing a breakable interconnection between the first substrate and the second substrate.  
     
     
         11 . The method of  claim 1  wherein at least one of the first substrate and the second substrate comprises a flexible circuit.  
     
     
         12 . A structure comprising: 
 an anisotropic conductive layer comprising at least one compliant conductive sphere disposed between a first substrate and a second substrate, wherein the at least one compliant conductive sphere contacts a first interconnect structure disposed on the first substrate and a second interconnect structure disposed on the second substrate; and    a clamp structure disposed on the first substrate and the second substrate that is capable of applying pressure to clamp the first substrate and the second substrate together.    
     
     
         13 . The structure of  claim 12  wherein the at least one compliant conductive sphere comprises a coating selected from the group consisting of nickel, gold, platinum and paladium and combinations thereof.  
     
     
         14 . The structure of  claim 12  wherein the at least one compliant conductive sphere comprises a matrix comprising at least one of epoxy, silicone, polyurethane and combinations thereof.  
     
     
         15 . The structure of  claim 12  wherein the anisotropic conductive layer comprises the at least one compliant conductive sphere dispersed within a polymeric matrix.  
     
     
         16 . The structure of  claim 15  wherein the polymeric matrix comprises at least one of polyurethane, polystyrene copolymer, and polyolefins, silicone, polyurethane, epoxy silicone and combinations thereof.  
     
     
         17 . The structure of  claim 12  wherein the clamp structure is capable of providing a breakable interconnection between the first substrate and the second substrate.  
     
     
         18 . The structure of  claim 12  wherein at least one of the first substrate and the second substrate comprises a flexible circuit.  
     
     
         19 . The structure of  claim 12  wherein the at least one compliant conductive sphere comprises a diameter between about 10 to about 300 microns.  
     
     
         20 . A system comprising: 
 a breakable interconnect structure comprising: 
 an anisotropic conductive layer, wherein the anisotropic conductive layer comprises at least one compliant conductive sphere disposed between a first substrate and a second substrate, and wherein the at least one compliant conductive sphere contacts a first interconnect structure disposed on the first substrate and a second interconnect structure disposed on the second substrate;  
 a clamp structure disposed on the first substrate and the second substrate that is capable of applying pressure to clamp the first substrate and the second substrate together;  
   a computing device communicatively coupled to the breakable interconnect structure; and    a DRAM communicatively coupled to the computing device.    
     
     
         21 . The system of  claim 20  wherein the anisotropic conductive layer comprises the at least one compliant conductive sphere dispersed within a polymeric matrix.  
     
     
         22 . The system of  claim 20  wherein the clamp structure is capable of providing a breakable interconnection between the first substrate and the second substrate.  
     
     
         23 . The system of  claim 20  wherein at least one of the first substrate and the second substrate comprises a flexible circuit.