Apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer

Abstract

An apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer is disclosed. The present invention uses an aligned process where the base plate imprint is fabricated on an electrically insulating layer and the reversed image is fabricated and etched into the coil insulation material, e.g., hard bake photoresist to alleviate the problems associated with complete ion removal of the seed layer between high aspect ratio coils. The present invention would also not be prone to plating non-uniformities (voids), and would not be subject to seed layer undercutting in a wet etch step process.

1 . An inductive head formed using an aligned coil for an inductive head structure, comprising: 
 an insulation layer provided over a magnetic material;    a pre-patterned seed layer deposited over the insulation layer;    a hard bake resist layer formed to overlay the seed layer and the insulation layer, wherein the hard bake resist layer forms at least one trench; and    an electroplatable metal formed in the trench to establish a coil, wherein the electroplatable metal is aligned with the seed layer via the trench.    
   
   
       2 . The inductive head of  claim 1  further comprising a coil insulator deposited over the coil.  
   
   
       3 . The inductive head of  claim 1  wherein the hard bake resist layer is replaced with an oxide that is readily etchable via reactive ion etching.  
   
   
       4 . The inductive head of  claim 2  further comprising a magnetic material formed over the coil insulator.  
   
   
       5 . The inductive head of  claim 1  wherein the seed layer is fabricated as a plated seed layer mask, wherein the plated seed layer mask includes large probe pads for plating contact.  
   
   
       6 . A magnetic storage device, comprising 
 magnetic media for storing data thereon;    a motor for translating the position of the magnetic media;    an actuator for positioning a magnetic head relative to the magnetic media, the magnetic head including an inductive head formed using an aligned coil for an inductive head structure, the inductive head further comprising: 
 an insulation layer provided over a magnetic material;  
 a pre-patterned seed layer deposited over the insulation layer;  
 a hard bake resist layer formed to overlay the seed layer and the insulation layer, wherein the hard bake resist layer forms at least one trench; and  
 an electroplatable metal formed in the trench to establish a coil, wherein the electroplatable metal is aligned with the seed layer via the trench.  
   
   
   
       7 . The magnetic storage device of  claim 6  further comprising a coil insulator deposited over the coil.  
   
   
       8 . The magnetic storage device of  claim 6  wherein the hard bake resist layer is replaced with an oxide that is readily etchable via reactive ion etching.  
   
   
       9 . The magnetic storage device of  claim 7  further comprising a second pole formed over the coil insulator.  
   
   
       10 . The magnetic storage device of  claim 6  wherein the seed layer is fabricated as a plated seed layer mask, wherein the plated seed layer mask includes large probe pads for plating contact.