Inventor · disambiguated record
Son V. Nguyen
Also filed as: NEUMAYER DEBORAH A · NGUYEN SON · NGUYEN SON V · NGUYEN SON VAN
275 granted patents·54 pending applications·8,273 citations·filing 1985–2025
99Inventor score
Files withIBM177EDWARDS LIFESCIENCES CORP75HITACHI GLOBAL STORAGE TECH13APPLIED MATERIALS INC10NGUYEN SON VAN5
Top patents by PatentIndex Score
329 records- 0199US10418277B2Air gap spacer formation for nano-scale semiconductor devicesIBM·Filed 2018·Granted Sep 17, 2019·159 cites·20 claims
- 0299US9892961B1Air gap spacer formation for nano-scale semiconductor devicesIBM·Filed 2016·Granted Feb 13, 2018·49 cites·13 claims
- 0399US8546956B2Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bondingIBM·Filed 2013·Granted Oct 1, 2013·214 cites·17 claims
- 0499US7049247B2Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device madeIBM·Filed 2004·Granted May 23, 2006·558 cites·28 claims
- 0598US11883281B2Sealing member for prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2022·Granted Jan 30, 2024·13 cites·17 claims
- 0698US11648111B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2021·Granted May 16, 2023·3 cites·24 claims
- 0798US11213388B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2019·Granted Jan 4, 2022·13 cites·20 claims
- 0898US10426611B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted Oct 1, 2019·42 cites·20 claims
- 0998US9947579B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Apr 17, 2018·15 cites·8 claims
- 1098US9786760B1Air gap and air spacer pinch offIBM·Filed 2016·Granted Oct 10, 2017·22 cites·7 claims
- 1198US9601371B2Interconnect structure with barrier layerIBM·Filed 2015·Granted Mar 21, 2017·16 cites·15 claims
- 1298US9349687B1Advanced manganese/manganese nitride cap/etch mask for air gap formation scheme in nanocopper low-K interconnectIBM·Filed 2015·Granted May 24, 2016·96 cites·20 claims
- 1398US8454685B2Low profile transcatheter heart valveHARITON ILIA·Filed 2011·Granted Jun 4, 2013·426 cites·24 claims
- 1498US7993394B2Low profile transcatheter heart valveHARITON ILIA·Filed 2009·Granted Aug 9, 2011·941 cites·11 claims
- 1598US7282458B2Low K and ultra low K SiCOH dielectric films and methods to form the sameIBM·Filed 2005·Granted Oct 16, 2007·97 cites·11 claims
- 1698US7088003B2Structures and methods for integration of ultralow-k dielectrics with improved reliabilityIBM·Filed 2004·Granted Aug 8, 2006·563 cites·10 claims
- 1797US11717399B2Devices and systems for docking a heart valveEDWARDS LIFESCIENCES CORP·Filed 2022·Granted Aug 8, 2023·9 cites·30 claims
- 1897US11628062B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2022·Granted Apr 18, 2023·3 cites·13 claims
- 1997US10478292B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted Nov 19, 2019·20 cites·19 claims
- 2097US10433959B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted Oct 8, 2019·21 cites·18 claims
- 2197US10433958B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted Oct 8, 2019·22 cites·20 claims
- 2297US10363130B2Devices and systems for docking a heart valveEDWARDS LIFESCIENCES CORP·Filed 2017·Granted Jul 30, 2019·41 cites·24 claims
- 2397US10224241B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Mar 5, 2019·9 cites·20 claims
- 2497US9947581B2Method of forming a copper based interconnect structureIBM·Filed 2016·Granted Apr 17, 2018·10 cites·17 claims
- 2597US9455182B2Interconnect structure with capping layer and barrier layerIBM·Filed 2014·Granted Sep 27, 2016·18 cites·20 claims
- 2697US9393110B2Prosthetic heart valveLEVI TAMIR S·Filed 2011·Granted Jul 19, 2016·423 cites·25 claims
- 2797US8568475B2Spiraled commissure attachment for prosthetic valveNGUYEN SON V·Filed 2011·Granted Oct 29, 2013·218 cites·19 claims
- 2897US8252051B2Method of implanting a prosthetic valve in a mitral valve with pulmonary vein anchoringCHAU MARK·Filed 2011·Granted Aug 28, 2012·701 cites·19 claims
- 2997US7381659B2Method for reducing film stress for SiCOH low-k dielectric materialsIBM·Filed 2005·Granted Jun 3, 2008·49 cites·20 claims
- 3096US10813749B2Docking device made with 3D woven fabricEDWARDS LIFESCIENCES CORP·Filed 2017·Granted Oct 27, 2020·10 cites·16 claims
- 3196US10777411B1Semiconductor device with selective dielectric depositionIBM·Filed 2019·Granted Sep 15, 2020·20 cites·18 claims
- 3296US10617520B2Method of replacing mitral valveEDWARDS LIFESCIENCES CORP·Filed 2017·Granted Apr 14, 2020·21 cites·19 claims
- 3396US10325806B2Copper interconnect structure with manganese oxide barrier layerIBM·Filed 2017·Granted Jun 18, 2019·9 cites·11 claims
- 3496US10115629B2Air gap spacer formation for nano-scale semiconductor devicesIBM·Filed 2017·Granted Oct 30, 2018·8 cites·8 claims
- 3596US9241792B2Two-step heart valve implantationBENICHOU NETANEL·Filed 2009·Granted Jan 26, 2016·150 cites·22 claims
- 3696US7030468B2Low k and ultra low k SiCOH dielectric films and methods to form the sameIBM·Filed 2004·Granted Apr 18, 2006·71 cites·45 claims
- 3796US5563105APECVD method of depositing fluorine doped oxide using a fluorine precursor containing a glass-forming elementIBM·Filed 1994·Granted Oct 8, 1996·332 cites·20 claims
- 3896US5536360AMethod for etching boron nitrideIBM·Filed 1995·Granted Jul 16, 1996·247 cites·4 claims
- 3995US10537423B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2016·Granted Jan 21, 2020·19 cites·20 claims
- 4095US10413407B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted Sep 17, 2019·14 cites·20 claims
- 4195US10292817B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2018·Granted May 21, 2019·13 cites·18 claims
- 4295US10195025B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2015·Granted Feb 5, 2019·34 cites·11 claims
- 4395US8927442B1SiCOH hardmask with graded transition layersIBM·Filed 2013·Granted Jan 6, 2015·33 cites·10 claims
- 4495US5468687AMethod of making TA2 O5 thin film by low temperature ozone plasma annealing (oxidation)IBM·Filed 1994·Granted Nov 21, 1995·129 cites·5 claims
- 4594US11717401B2Prosthetic heart valve assemblyEDWARDS LIFESCIENCES CORP·Filed 2021·Granted Aug 8, 2023·2 cites·20 claims
- 4694US10957850B2Multi-layer encapsulation to enable endpoint-based process control for embedded memory fabricationIBM·Filed 2018·Granted Mar 23, 2021·6 cites·18 claims
- 4794US9974650B2Prosthetic heart valveEDWARDS LIFESCIENCES CORP·Filed 2016·Granted May 22, 2018·19 cites·23 claims
- 4894US9974652B2Low profile transcatheter heart valveEDWARDS LIFESCIENCES CORP·Filed 2017·Granted May 22, 2018·11 cites·19 claims
- 4994US9793193B1Air gap and air spacer pinch offIBM·Filed 2016·Granted Oct 17, 2017·7 cites·7 claims
- 5094US8431436B1Three-dimensional (3D) integrated circuit with enhanced copper-to-copper bondingNGUYEN SON V·Filed 2011·Granted Apr 30, 2013·19 cites·12 claims
Showing the top 50 of 329 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →