Solder composition

Abstract

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

1 . A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium.  
     
     
         2 . The solder composition of  claim 1  further comprising copper.  
     
     
         3 . The solder composition of  claim 2  in which the composition includes about 1% to 10% silver, about 0.25% to 6% bismuth, and about 0.25% to 0.75% copper.  
     
     
         4 . The solder composition of  claim 3  in which the composition includes about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         5 . The solder composition of  claim 1  in which the composition includes about 50% to 83% tin.  
     
     
         6 . The solder composition of  claim 5  in which the composition includes about 15% to 45% indium.  
     
     
         7 . The solder composition of  claim 1  in which the composition has a solidus temperature below about 315° F.  
     
     
         8 . A solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin, about 13% to 65% indium, and about 0.25% to 4% bismuth.  
     
     
         9 . The solder composition of  claim 8  further comprising copper.  
     
     
         10 . The solder composition of  claim 9  in which the composition includes about 1% to 10% silver, and about 0.25% to 0.75% copper.  
     
     
         11 . The solder composition of  claim 10  in which the composition includes about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         12 . The solder composition of  claim 8  in which the composition includes about 50% to 83% tin.  
     
     
         13 . The solder composition of  claim 12  in which the composition includes about 13% to 45% indium.  
     
     
         14 . The solder composition of  claim 12  in which the composition includes about 15% to 45% indium.  
     
     
         15 . The solder composition of  claim 8  in which the composition has a solidus temperature below about 315° F.  
     
     
         16 . A solder composition having a mixture of elements comprising tin, indium, silver, bismuth and copper, and including about 30% to 85% tin and about 13% to 65% indium.  
     
     
         17 . The solder composition of  claim 16  in which the composition includes about 1% to 10% silver, about 0.25% to 6% bismuth, and about 0.25% to 0.75% copper.  
     
     
         18 . The solder composition of  claim 17  in which the composition includes about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         19 . The solder composition of  claim 16  in which the composition includes about 50% to 83% tin.  
     
     
         20 . The solder composition of  claim 19  in which the composition includes about 13% to 45% indium.  
     
     
         21 . The solder composition of  claim 20  in which the composition includes about 15% to 45% indium.  
     
     
         22 . The solder composition of  claim 18  in which the composition comprises about 66% to 85% tin, and about 13% to 26% indium.  
     
     
         23 . The solder composition of  claim 16  in which the composition has a solidus temperature below about 315° F.  
     
     
         24 . The solder composition of  claim 16  in which the composition comprises about 70% to 80% tin, and about 15% to 26% indium.  
     
     
         25 . The solder composition of  claim 16  in which the composition comprises about 70% to 74% tin, about 18% to 26% indium, about 1% to 6% silver, about 0.25% to 4% bismuth and about 0.25% to 0.75% copper.  
     
     
         26 . The solder composition of  claim 16  in which the composition comprises about 73% to 78% tin, about 17% to 22% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         27 . The solder composition of  claim 16  in which the composition comprises about 78% to 85% tin, about 13% to 16% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         28 . A solder composition comprising tin, indium and silver, and including more than about 60% tin, the composition having a solidus temperature below about 330° F.  
     
     
         29 . The solder composition of  claim 28  in which the solidus temperature is below about 315° F.  
     
     
         30 . The solder composition of  claim 29  further comprising bismuth.  
     
     
         31 . The solder composition of  claim 30  further comprising copper.  
     
     
         32 . A method of forming a solder composition comprising mixing tin, indium, silver, and bismuth together, and including about 30% to 85% tin and about 15% to 65% indium.  
     
     
         33 . The method of  claim 32  further comprising mixing copper.  
     
     
         34 . The method of  claim 33  further comprising mixing about 1% to 10% silver, about 0.25% to 6% bismuth, and about 0.25% to 0.75% copper.  
     
     
         35 . The method of  claim 34  further comprising mixing about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         36 . The method of  claim 32  further comprising mixing about 50% to 83% tin.  
     
     
         37 . The method of  claim 36  further comprising mixing about 15% to 45% indium.  
     
     
         38 . The method of  claim 32  further comprising providing the composition with a solidus temperature below about 315° F.  
     
     
         39 . A method of forming a solder composition comprising mixing tin, indium, silver, and bismuth together, and including about 30% to 85% tin, about 13% to 65% indium, and about 0.25% to 4% bismuth.  
     
     
         40 . The method of  claim 39  further comprising mixing copper.  
     
     
         41 . The method of  claim 40  further comprising mixing about 1% to 10% silver, and about 0.25% to 0.75% copper.  
     
     
         42 . The method of  claim 41  further comprising mixing about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         43 . The method of  claim 39  further comprising mixing about 50% to 83% tin.  
     
     
         44 . The method of  claim 42  further comprising mixing about 13% to 45% indium.  
     
     
         45 . The method of  claim 43  further comprising mixing about 15% to 45% indium.  
     
     
         46 . The method of  claim 39  further comprising providing the composition with a solidus temperature below about 315° F.  
     
     
         47 . A method of forming a solder composition comprising mixing tin, indium, silver, bismuth and copper together, and including about 30% to 85% tin and about 13% to 65% indium.  
     
     
         48 . The method of  claim 47  further comprising mixing about 1% to 10% silver, about 0.25% to 6% bismuth, and about 0.25% to 0.75% copper.  
     
     
         49 . The method of  claim 48  further comprising mixing about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         50 . The method of  claim 47  further comprising mixing about 50% to 83% tin.  
     
     
         51 . The method of  claim 50  further comprising mixing about 13% to 45% indium.  
     
     
         52 . The method of  claim 51  further comprising mixing about 15% to 45% indium.  
     
     
         53 . The method of  claim 49  further comprising mixing about 66% to 85% tin and about 13% to 26% indium.  
     
     
         54 . The method of  claim 47  further comprising providing the composition with a solidus temperature below about 315° F.  
     
     
         55 . The method of  claim 47  further comprising mixing about 70% to 80% tin, and about 15% to 26% indium.  
     
     
         56 . The method of  claim 47  further comprising mixing about 70% to 74% tin, about 18% to 26% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         57 . The method of  claim 47  further comprising mixing about 73% to 78% tin, about 17% to 22% indium, about 1% to 6% silver, about 0.25% to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         58 . The method of  claim 47  further comprising mixing about 78% to 85% tin, about 13% to 16% indium, about 1% to 6% silver, about 0.25 to 4% bismuth, and about 0.25% to 0.75% copper.  
     
     
         59 . A method forming a solder composition comprising mixing tin, indium and silver together, including more than about 60% tin, and providing the composition with a solidus temperature below about 330° F.  
     
     
         60 . The method of  claim 59  further comprising providing a solidus temperature below about 315° F.  
     
     
         61 . The method of  claim 60  further comprising mixing bismuth.  
     
     
         62 . The method of  claim 61  further comprising mixing copper.  
     
     
         63 . A method of soldering comprising: 
 providing a solder composition having a mixture of elements comprising tin, indium, silver, and bismuth, and including about 30% to 85% tin and about 15% to 65% indium; and    melting the solder composition with a soldering device.