Assignee
PEREIRA JOHN
US·1 granted patent·5 pending applications·7 citations·filing 2006–2012
Top patents by PatentIndex Score
6 records- 0175US8474681B1Solder apparatusPEREIRA JOHN·Filed 2012·Granted Jul 2, 2013·7 cites·7 claims
- 0247US2008175748A1Solder CompositionPEREIRA JOHN·Filed 2008·Application pending·0 cites
- 0343US2007036670A1Solder compositionPEREIRA JOHN·Filed 2006·Application pending·0 cites
- 0443US2007292708A1Solder compositionPEREIRA JOHN·Filed 2007·Application pending·0 cites
- 0542US2007231594A1Multilayer solder articlePEREIRA JOHN·Filed 2006·Application pending·0 cites
- 0635US2007281049A1Wire mat and apparatus for making the samePEREIRA JOHN·Filed 2006·Application pending·0 cites
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