Solder Composition

Abstract

A solder composition having a mixture of elements including tin, indium, silver, and bismuth, and can include about 30% to 85% tin and about 15% to 65% indium.

1 . A solder composition having a mixture of elements comprising tin, indium silver and bismuth, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth. 
     
     
         2 . The solder composition of  claim 1  further comprising copper. 
     
     
         3 . The solder composition of  claim 2  in which the composition includes about 1% to 10% silver, and about 0.25% to 0.75% copper. 
     
     
         4 . The solder composition of  claim 2  in which the composition includes about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         5 . The solder composition of  claim 4  in which the composition includes about 35% to 75% tin, and about 15% to 60% indium. 
     
     
         6 . The solder composition of  claim 4  in which the composition includes about 35% to 65% tin, and about 30% to 60% indium. 
     
     
         7 . The solder composition of  claim 2  in which the composition comprises about 37% to 42% tin, about 53% to 57% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         8 . The solder composition of  claim 7  in which the composition comprises about 39% tin, about 55% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         9 . The solder composition of  claim 2  in which the composition comprises about 47% to 52% tin, about 40% to 47% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         10 . The solder composition of  claim 9  in which the composition comprises about 49% tin, about 45% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         11 . The solder composition of  claim 2  in which the solder composition comprises about 58% to 63% tin, about 28% to 37% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         12 . The solder composition of  claim 11  in which the composition comprises about 60% tin, about 35% indium, about 3% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         13 . The solder composition of  claim 2  in which the composition comprises about 69% to 75% tin, about 17% to 27% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         14 . The solder composition of  claim 13  in which the composition comprises about 71% tin, about 25% indium, about 2% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         15 . A method of forming a solder composition comprising mixing tin, indium silver and bismuth together, and including above 30% tin to 85% tin, below 65% indium to 15% indium, and above 0.25% up to about 6% bismuth. 
     
     
         16 . The method of  claim 15  further comprising mixing copper. 
     
     
         17 . The method of  claim 16  further comprising mixing about 1% to 10% silver, and about 0.25% to 0.75% copper. 
     
     
         18 . The method of  claim 16  further comprising mixing about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         19 . The method of  claim 18  further comprising mixing about 35% to 75% tin, and about 15% to 60% indium. 
     
     
         20 . The method of  claim 18  further comprising mixing about 35% to 65% tin, and about 30% to 60% indium. 
     
     
         21 . The method of  claim 16  further comprising mixing about 37% to 42% tin, about 53% to 57% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         22 . The method of  claim 21  comprising mixing about 39% tin, about 55% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         23 . The method of  claim 16  further comprising mixing about 47% to 52% tin, about 40% to 47% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         24 . The method of  claim 23  further comprising mixing about 49% tin, about 45% indium, about 4% silver, about 1.5% bismuth, and about 0.5% copper. 
     
     
         25 . The method of  claim 16  further comprising mixing about 58% to 63% tin, about 28% to 37% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         26 . The method of  claim 25  further comprising mixing about 60% tin, about 35% indium, about 3% silver, about 1.5% bismuth and about 0.5% copper. 
     
     
         27 . The method of  claim 16  further comprising mixing about 69% to 75% tin, about 17% to 27% indium, about 1% to 6% silver, above 0.25% up to about 4% bismuth, and about 0.25% to 0.75% copper. 
     
     
         28 . The method of  claim 27  further comprising mixing about 71% tin, about 25% indium, about 2% silver, about 1.5% bismuth, and about 0.5% copper.