After deposition method of thinning film to reduce pinhole defects

Abstract

A method of forming a thin film is provided in which a film having a first thickness is deposited over a substrate, wherein the first thickness is greater than a thickness at which the initially deposited film begins to dewet from the substrate. The initially deposited film is then stabilized to form a stabilized film. Thereafter, the stabilized film is then thinned to a second thickness, such that the resulting film now has a smaller thickness than the thickness at which the initially deposited film would begin to dewet from the substrate. However, as a result of the prior stabilization, the reduced thickness film remains free of dewetting defects.

1 . A method of forming a thin film, comprising: 
 initially depositing a film having a first thickness over a substrate, said first thickness being greater than a thickness at which said initially deposited film begins to dewet from said substrate;    stabilizing said initially deposited film to form a stabilized film; and    thinning said stabilized film to a second thickness, said second thickness less than said thickness at which said initially deposited film begins to dewet from said substrate, said stabilized film having said second thickness remaining free of dewetting defects.