Process of forming socket contacts

Abstract

A socket contact formation process comprises forming a contact head from a conductive material, forming a contact body from a semiconductive material configured to be electrically conductive; and joining the contact head and the contact body.

1 . An electrical connector, comprising: 
 an elongated conductive body defining a central axis and having an end;    an electrically conductive annular portion at said end concentric to said central axis;    an electrically conductive frustoconical portion extending inward from said annular portion toward said central axis; and    an electrically conductive planar portion below said annular portion, concentric to said central axis, and coupled to said frustoconical portion.    
     
     
         2 . The electrical connector in  claim 1 , wherein said body comprises a pogo pin.  
     
     
         3 . A socket contact head, comprising: 
 a flat area;    a sidewall extending upward and outward from said flat area; and    a perimeter portion extending outward from said sidewall; wherein a selection of said flat area, said sidewall, said perimeter portion, and combinations thereof is configured to receive an IC chip contact and further configured to transmit an electrical signal along a socket contact body.    
     
     
         4 . The socket contact head of  3 , wherein said sidewall comprises a plurality of planar walls.  
     
     
         5 . The socket contact head of  claim 4 , wherein said sidewall comprises: 
 a first planar wall;    a second planar wall coupled to said first planar wall; and    a third planar wall coupled to said first planar wall and said second planar wall.    
     
     
         6 . An electrically conductive contact head, comprising: 
 an upper portion defining an opening;    a sidewall coupled to said upper portion at a first transition area and decliningly converging from said first transition area;    a lower portion coupled to said sidewall at a second transition area; and    an electrical connection contact area at a selection of said upper portion, said sidewall, said lower portion, and combinations thereof;    wherein a selection of said upper portion, said sidewall, said lower portion, and combinations thereof is configured to contact a socket contact body.    
     
     
         7 . The electrically conductive contact head in  claim 6 , wherein said electrical connection contact area defines a circle along said sidewall.  
     
     
         8 . The electrically conductive contact head in  claim 6 , wherein said electrical connection contact area defines a plurality of points along said sidewall.  
     
     
         9 . The electrically conductive contact head in  claim 6 , wherein said electrical connection contact area comprises: 
 at least a circle along said sidewall; and    at least a point on said lower portion.    
     
     
         10 . The electrically conductive contact head in  claim 6 , wherein said electrical connection contact area coincides with at least a portion of said upper portion.  
     
     
         11 . The electrically conductive contact head in  claim 6 , wherein said electrical connection contact area coincides with said first transition area.  
     
     
         12 . The electrically conductive contact head in  claim 11 , wherein said first transition area is rounded.  
     
     
         13 . A receptacle for an IC chip contact, comprising: 
 a metal layer having a shape that is at least generally complimentary to said IC chip contact, wherein said layer comprises: 
 an outer surface,  
 a curved middle surface transitioning from said outer surface, and  
 a curved inner surface transitioning from said middle surface; and  
 a conductive material in electrical communication with said metal layer and extending generally unidirectionally from said metal layer.  
   
     
     
         14 . The receptacle in  claim 13 , wherein said outer surface comprises a curved surface.  
     
     
         15 . An electrical connection device, comprising: 
 a head defining an inner frustum-shaped recess and sized to accommodate an IC chip contact; and    a resilient body coupled to said head.    
     
     
         16 . The electrical connection device of  claim 15 , wherein said resilient body comprises: 
 a doped semiconductor shaft; and    an elastomer material contacting said shaft.    
     
     
         17 . The electrical connection device of  claim 15 , wherein said resilient body comprises a compressible metallic element.  
     
     
         18 . The electrical connection device of  claim 17 , wherein said resilient body comprises a tube defining at least one aperture therein.  
     
     
         19 . The electrical connection device of  claim 17 , wherein said resilient body comprises: 
 a spring coupled to said head; and    a shaft coupled to said spring.    
     
     
         20 . The electrical connection device of  claim 19 , wherein said resilient body further comprises a shell coupled to said head and outwardly concentric to said shaft.  
     
     
         21 . A pin for a socket, comprising: 
 a head having a central recess; and    a shaft in electrical communication with said head and biased from said head, wherein said shaft is configured to extend from said socket.    
     
     
         22 . The pin in  claim 21 , further comprising a spring coupled to and interposed between said head and said shaft.  
     
     
         23 . The pin in  claim 22 , wherein said spring defines a plurality of coil circumferences.  
     
     
         24 . The pin in  claim 23 , wherein said spring comprises: 
 a first section next to said head and defining a first coil circumference;    a second section next to said first section and defining a second coil circumference; and    a third section between said second section and said shaft and defining a third coil circumference generally equal to said first coil circumference.    
     
     
         25 . The pin in  claim 24  wherein said second coil circumference is greater than said first coil circumference.  
     
     
         26 . The pin in  claim 25 , wherein said second section of said spring is configured to contact a nonconductive portion of said socket.  
     
     
         27 . A socket connector comprising: 
 a cup-shaped head; and    a resilient tube next to said head and defining at least one aperture in said tube, wherein said tube is configured to at least partially extend into a socket hole.    
     
     
         28 . The socket connector in  claim 27 , wherein said tube defines a plurality of apertures at one length along said tube.  
     
     
         29 . The socket connector in  claim 27 , wherein said tube defines a first aperture at a first length along said tube; and a second aperture at a second length along said tube.  
     
     
         30 . The socket connector in  claim 27 , wherein said tube defines a first aperture on a first side of said tube and a second aperture on a second side of said tube.  
     
     
         31 . The socket connector of  claim 30 , wherein said head is integral to said tube.  
     
     
         32 . A contact, comprising: 
 a metal body sized to partially fit within an IC chip socket, wherein said metal body defines: 
 a generally continuous profile; and  
 at least one deformation of said profile.  
   
     
     
         33 . The contact in  claim 32 , wherein said generally continuous profile comprises a cylindrical profile; and wherein said deformation comprises a rectangular slit.  
     
     
         34 . The contact in  claim 32 , wherein said deformation comprises a semi-circular aperture.  
     
     
         35 . A method of processing an array of contacts, comprising: 
 defining a general shape for each contact of a plurality of contacts, such that said contacts are structurally interconnected;    reinforcing the positioning of said each contact relative to other contacts in said plurality after said defining a general shape for each contact of said plurality of contacts;    singulating said plurality of contacts after said maintaining a position of said each contact relative to other contacts in said plurality; and    attaching said plurality of contacts to a substrate after said singulating said plurality of contacts.    
     
     
         36 . A method of forming a socket, comprising: 
 providing a semiconductor substrate;    defining an arrangement of a plurality of socket contacts from said substrate;    preserving said arrangement;    providing a substrate having a plurality of conductive leads; and    attaching said plurality of socket contacts to said substrate, wherein at least one socket contact is over at least one conductive lead.    
     
     
         37 . The method in  claim 36 , wherein said step of attaching said plurality of socket contacts to said substrate comprises attaching said plurality of socket contacts to said substrate with a conductive elastomer.  
     
     
         38 . The method in  claim 37 , wherein said step of attaching said plurality of socket contacts to said substrate with a conductive elastomer comprises: 
 placing said elastomer onto said substrate; and    placing said plurality of socket contacts onto said elastomer.    
     
     
         39 . The method in  claim 37 , wherein said step of attaching said plurality of socket contacts to said substrate with a conductive elastomer comprises: 
 placing said elastomer onto an underside of said plurality of socket contacts; and    placing said substrate onto an underside of said elastomer.    
     
     
         40 . The method in  claim 39 , wherein said step of preserving said arrangement comprises preserving said arrangement with said elastomer.  
     
     
         41 . A method of supporting electrical communication through a socket between an IC chip and a printed circuit board, comprising: 
 interposing a semiconductive shaft between said IC chip and said printed circuit board;    connecting said shaft to said printed circuit board with an adhesive material; and    allowing electrical conductivity through said adhesive material in response to a compression between said shaft and said printed circuit board.