US2007045842A1PendingUtilityA1
Lead-containing solder bumps
Est. expiryOct 8, 2022(expired)· nominal 20-yr term from priority
B23K 35/268C25C 1/18C22B 13/06B23K 35/025B23K 35/26H10W 72/90H10W 72/9415H10W 90/724H10W 72/252H10W 72/251H10W 90/701H10W 74/117H10W 72/20H05K 3/346H05K 3/3485
46
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Claims
Abstract
The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
Claims
exact text as granted — not AI-modified1 - 13 . (canceled)
14 . A lead-containing solder bump having an alpha flux of less than 0.001 cts/cm 2 /hr, the lead-containing solder bump comprising at least about 50 weight % lead.
15 . The lead-containing solder bump of claim 14 having an alpha flux of less than 0.0005 cts/cm 2 /hr.
16 . The lead-containing solder bump of claim 14 having an alpha flux of less than 0.0002 cts/cm 2 /hr.
17 . The lead-containing solder bump of claim 14 having an alpha flux of less than 0.0001 cts/cm 2 /hr.
18 - 29 . (canceled)Join the waitlist — get patent alerts
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