Assignee
WEISER MARTIN W
US·1 granted patent·7 pending applications·0 citations·filing 2006–2010
Top patents by PatentIndex Score
8 records- 0150US9666547B2Method of refining solder materialsWEISER MARTIN W·Filed 2010·Granted May 30, 2017·0 cites·20 claims
- 0246US2007045839A1Lead-containing solder pasteWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 0346US2007045842A1Lead-containing solder bumpsWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 0446US2007045838A1Lead-containing anodesWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 0538US2008118761A1Modified solder alloys for electrical interconnects, methods of production and uses thereofWEISER MARTIN W·Filed 2007·Application pending·0 cites
- 0636US2007138442A1Modified and doped solder alloys for electrical interconnects, methods of production and uses thereofWEISER MARTIN W·Filed 2006·Application pending·0 cites
- 0735US2008291634A1Thermal interconnect and interface materials, methods of production and uses thereofWEISER MARTIN W·Filed 2008·Application pending·0 cites
- 0834US2008023665A1Thermal interconnect and interface materials, methods of production and uses thereofWEISER MARTIN W·Filed 2006·Application pending·0 cites
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