Thermal interconnect and interface materials, methods of production and uses thereof

Abstract

Thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material. Methods of forming thermal interface materials are also disclosed that include providing each of the at least one matrix material component, at least one high conductivity filler, at least one solder material and at least one material modification agent, blending the components; and optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component. Also, thermal interface materials are disclosed that include at least one matrix material component, at least one high conductivity filler component, at least one solder material; and at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.

1 . A thermal interface material, comprising:
 at least one matrix material component,   at least one high conductivity filler component,   at least one solder material; and   at least one material modification agent, wherein the at least one material modification agent improves the thermal performance, compatibility, physical quality or a combination thereof of the thermal interface material.   
   
   
       2 . The thermal interface material of  claim 1 , wherein the at least one matrix material comprises a siloxane-based component. 
   
   
       3 . The thermal interface material of  claim 2 , wherein the at least one matrix material further comprises an epoxy component. 
   
   
       4 . The thermal interface material of  claim 1 , wherein the at least one matrix material component is cured to form a matrix material. 
   
   
       5 . The thermal interface material of  claim 4 , wherein a linear chain length of the matrix material is increased by using at least one high molecular weight linear matrix material component. 
   
   
       6 . The thermal interface material of  claim 5 , wherein the linear chain length of the matrix material is increased by either hydride or vinyl terminating at least one of the at least one matrix material component. 
   
   
       7 . The thermal interface material of  claim 5 , wherein the linear chain length of the matrix material is increased by decreasing a crosslinker concentration. 
   
   
       8 . The thermal interface material of  claim 1 , wherein the high conductivity filler component is dispersed in the thermal interface material. 
   
   
       9 . The thermal interface material of  claim 1 , wherein the at least one high conductivity filler component comprises silver, copper, aluminum, and alloys thereof; boron nitride, aluminum spheres, aluminum nitride, silver coated copper, silver coated aluminum, carbon fibers, and carbon fibers coated with metals, metal alloys, conductive polymers or other composite materials or combinations thereof. 
   
   
       10 . The thermal interface material of  claim 1 , wherein the at least one high conductivity filler component comprises silver, silver-coated copper or a combination thereof in an amount of at least about 40 weight percent. 
   
   
       11 . The thermal interface material of  claim 1 , wherein the at least one high conductivity filler component comprises at least two high conductivity components, wherein each component comprises a different particle size distribution from the other components. 
   
   
       12 . The thermal interface material of  claim 11 , wherein each of the high conductivity filler components are selected such that the mixture forms a bimodal particle size distribution or a trimodal particle size distribution. 
   
   
       13 . The thermal interface material of  claim 1 , wherein the at least one solder material comprises indium, silver, copper, aluminum, tin, bismuth, lead, gallium and combinations or alloys thereof. 
   
   
       14 . The thermal interface material of  claim 13 , wherein the at least one solder material comprises tin, bismuth, indium or a combination thereof. 
   
   
       15 . The thermal interface material of  claim 1 , wherein the at least one solder material comprises solder particles. 
   
   
       16 . The thermal interface material of  claim 1 , wherein the at least one material modification agent comprises at least one inhibitor. 
   
   
       17 . The thermal interface material of  claim 16 , wherein the at least one inhibitor comprises a diol component, a triol component, a tetraol component, a carboxylic acid-based component, a plurality of small molecules that will coordinate with at least one coordination metal or a combination thereof. 
   
   
       18 . The thermal interface material of  claim 17 , wherein the diol component comprises 3-hexylene-2,5-diol. 
   
   
       19 . The thermal interface material of  claim 17 , wherein the at least one coordination metal comprises platinum. 
   
   
       20 . The thermal interface material of  claim 16 , wherein the at least one inhibitor is designed to extend the pot life of the thermal interface material, increase the elasticity of the matrix material, inhibit polymerization of the matrix material or a combination thereof. 
   
   
       21 . The thermal interface material of  claim 1 , wherein the at least one material modification agent comprises a polyol component, a carboxylic acid-containing molecule, an epoxy-functionalized siloxane material or a combination thereof. 
   
   
       22 . The thermal interface material of  claim 21 , wherein the polyol component comprises a polyalkene glycol. 
   
   
       23 . The thermal interface material of  claim 22 , wherein the polyalkene glycol comprises polypropylene glycol or polyethylene glycol. 
   
   
       24 . The thermal interface material of  claim 21 , wherein the carboxylic acid-containing molecule comprises stearic acid or oleic acid. 
   
   
       25 . The thermal interface material of  claim 21 , wherein the epoxy-functionalized siloxane material is designed to enhance adhesion to a substrate. 
   
   
       26 . The thermal interface material of  claim 1 , wherein the at least one material modification agent comprises at least one modified thermal filler profile. 
   
   
       27 . The thermal interface material of  claim 26 , wherein the at least one modified thermal filler profile comprises a plurality of incorporatable thermal fillers that are designed to optimize the particle size distribution in the thermal interface material. 
   
   
       28 . The thermal interface material of  claim 27 , wherein optimizing the particle size distribution includes maximizing the volume fraction loading. 
   
   
       29 . The thermal interface material of  claim 28 , wherein maximizing the volume fraction loading includes a volume fraction loading of at least 60 volume percent. 
   
   
       30 . The thermal interface material of  claim 28 , wherein maximizing the volume fraction loading includes a volume fraction loading of at least 65 volume percent. 
   
   
       31 . The thermal interface material of  claim 28 , wherein maximizing the volume fraction loading includes a volume fraction loading of at least 70 volume percent. 
   
   
       32 . The thermal interface material of  claim 1 , wherein the at least one high conductivity filler component and the at least one solder component are selected so that the mixture forms a bimodal particle size distribution or a trimodal particle size distribution. 
   
   
       33 . The thermal interface material of  claim 1 , wherein at least one of the at least one high conductivity filler component comprises particles having a diameter of less than about 80 μm and the mean size of the high conductivity particles is larger than the mean particle size of the solder particles. 
   
   
       34 . The thermal interface material of  claim 33 , wherein the at least one high conductivity filler component comprises particles having a diameter of less than about 50 μm. 
   
   
       35 . The thermal interface material of  claim 1 , wherein at least one of the at least one high conductivity filler and the at least one solder material is coated with a carboxylic acid-containing molecule prior to incorporation into the thermal interface material. 
   
   
       36 . The thermal interface material of  claim 1 , wherein a carboxylic acid group or its precursor is incorporated into the at least one matrix material. 
   
   
       37 . The thermal interface material of  claim 36 , wherein the carboxylic acid group or its precursor is incorporated onto the at least one matrix material as a side group substituent or as a terminal group substituent. 
   
   
       38 . The thermal interface material of  claim 1 , wherein the thermal interface material comprises metal flakes, sintered metal flakes or a combination thereof. 
   
   
       39 . The thermal interface material of  claim 1 , wherein the thermal interface material has a thermal conductivity of greater than about 3 W/m-K. 
   
   
       40 . The thermal interface material of  claim 39 , wherein the thermal interface material has a thermal conductivity of greater than about 10 W/m-K. 
   
   
       41 . The thermal interface material of  claim 40 , wherein the thermal interface material has a thermal conductivity of greater than about 20 W/m-K. 
   
   
       42 . A method of forming a thermal interface material, comprising:
 providing each of the at least one matrix material, at least one high conductivity filler, at least one solder material and at least one material modification agent,   blending the components; and   optionally curing the components pre- or post-application of the thermal interface material to the surface, substrate or component.   
   
   
       43 . The method of  claim 42 , wherein the cured thermal interface material is no crosslinked. 
   
   
       44 . A thermal interface material, comprising:
 at least one matrix material,   at least one high conductivity filler component,   at least one solder material; and   at least one material modification agent, wherein the at least one material modification agent at least one modified thermal filler profile.   
   
   
       45 . The thermal interface material of  claim 44 , wherein the at least one modified thermal filler profile comprises a plurality of incorporatable thermal fillers that are designed to optimize the particle size distribution for the highest possible volume fraction loading.