Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing

Abstract

A retaining ring structure for a chemical mechanical polishing (CMP) apparatus includes a plurality of protrusions formed on a bottom surface of a retaining ring configured for retaining a workpiece to be polished, the protrusions disposed so as to be in contact with a polishing pad during a polishing operation on the workpiece.

1 . A retaining ring structure for a chemical mechanical polishing (CMP) apparatus, comprising: 
 a plurality of protrusions formed on a bottom surface of a retaining ring configured for retaining a workpiece to be polished, said protrusions disposed so as to be in contact with a polishing pad during a polishing operation on the workpiece;    wherein said plurality of protrusions are sized so as to activate abrasive particles of a fixed abrasive CMP pad.    
     
     
         2 . (canceled)  
     
     
         3 . The retaining ring structure of  claim 1 , wherein said plurality of protrusions have a height of about 0.01 microns to about 200 microns.  
     
     
         4 . (canceled)  
     
     
         5 . (canceled)  
     
     
         6 . The retaining ring structure of  claim 1 , wherein said plurality of protrusions further comprise at least one or more of: spherical shapes, pyramidal shapes, conical shapes, and polygonal shapes.  
     
     
         7 . A carrier assembly for a chemical mechanical polishing (CMP) apparatus, comprising: 
 a polishing head;    a carrier surface having a workpiece to be polished mounted thereon; and    a retaining ring circumferentially disposed about said workpiece, said retaining ring further comprising a plurality of protrusions formed on a bottom surface thereof, said protrusions disposed so as to be in contact with a polishing pad during a polishing operation on said workpiece;    wherein said plurality of protrusions are sized so as to activate abrasive particles of a fixed abrasive CMP pad.    
     
     
         8 . (canceled)  
     
     
         9 . The carrier assembly of  claim 7 , wherein said plurality of protrusions have a height of about 0.01 microns to about 200 microns.  
     
     
         10 . (canceled)  
     
     
         11 . (canceled)  
     
     
         12 . The carrier assembly of  claim 7 , wherein said plurality of protrusions further comprise at least one or more of: spherical shapes, pyramidal shapes, conical shapes, and polygonal shapes.  
     
     
         13 . A chemical mechanical polishing (CMP) apparatus, comprising: 
 a carrier assembly extending from a rotary chuck;    said carrier assembly including a polishing head, a carrier surface having a workpiece to be polished mounted thereon, and a retaining ring circumferentially disposed about said workpiece;    a platen having a CMP pad mounted thereon; and    said retaining ring further comprising a plurality of protrusions formed on a bottom surface thereof, said protrusions disposed so as to be in contact with said pad during a polishing operation on said workpiece;    wherein said plurality of protrusions are sized so as to activate abrasive particles of a fixed abrasive CMP pad.    
     
     
         14 . (canceled)  
     
     
         15 . The CMP apparatus of  claim 13 , wherein said plurality of protrusions have a height of about 0.01 microns to about 200 microns.  
     
     
         16 . (canceled)  
     
     
         17 . (canceled)  
     
     
         18 . The CMP apparatus of  claim 13 , wherein said plurality of protrusions further comprise at least one or more of: spherical shapes, pyramidal shapes, conical shapes, and polygonal shapes.