System and Method for Noise Reduction in Multi-Layer Ceramic Packages

Abstract

A system and method for reducing noise in a multi-layer ceramic package are provided. With the system and method, additional shielding wires are inserted into the reference planes wherever there are no signal vias present. These additional lines in the reference planes force stronger signal interaction with the reference (vdd/gnd) thereby reducing the interaction between the signals in the signal layers. As a result, the noise present in the signals of the signal layers is reduced.

1 - 6 . (canceled)  
   
   
       7 . A method of fabricating a multi-layered ceramic package, comprising: 
 receiving an unshielded multi-layered ceramic package design, wherein the unshielded multi-layered ceramic package design includes a plurality of signal layers and at least one reference mesh layer adjacent one or more signal layers of the plurality of signal layers;    inserting, into the unshielded multi-layered ceramic package design, additional shielding reference lines into the at least one reference mesh layer to generate a shielded multi-layered ceramic package design; and    fabricating the multi-layered ceramic package based on the shielded multi-layered ceramic package design.    
   
   
       8 . The method of  claim 7 , wherein the unshielded multi-layered ceramic package design further includes one or more vias running through one or more signal layers of the plurality of the signal layers and one or more reference mesh layers of the at least one reference mesh layer.  
   
   
       9 . The method of  claim 8 , further comprising: 
 analyzing the unshielded multi-layered ceramic package design to identify portions of the at least one reference mesh layer that do not include the one or more vias.    
   
   
       10 . The method of  claim 9 , wherein inserting additional shielding reference lines into the at least one reference mesh layer includes inserting the additional shielding reference lines at the identified portions of the at least one reference mesh layer that do not include the one or more vias.  
   
   
       11 . The method of  claim 7 , wherein the at least one reference mesh layer includes at least two reference mesh layers, and wherein each signal layer of the plurality of signal layers is sandwiched between two reference mesh layers of the at least two reference mesh layers.  
   
   
       12 . The method of  claim 7 , wherein the plurality of signal lines are arranged in one of an orthogonal and a diagonal wiring pattern.  
   
   
       13 . The method of  claim 7 , wherein the multi-layered ceramic package is a glass-ceramic package.  
   
   
       14 - 20 . (canceled)  
   
   
       21 . The method of  claim 7 , wherein, in the fabricated multi-layered ceramic package, the additional shielding reference lines are connected to a wire mesh of the at least one reference mesh layer, and wherein the additional shielding reference lines take on a polarity of a particular reference mesh layer in which they are inserted due to the connection with the wire mesh.  
   
   
       22 . The method of  claim 7 , wherein the additional shielding reference lines reduce both near end noise and far end noise in signal lines of the plurality of signal layers.  
   
   
       23 . The method of  claim 22 , wherein the additional shielding reference lines reduce both near end noise and far end noise in the signal lines by approximately 40 percent.