Dual substrate loadlock process equipment

Abstract

One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

1 . A loadlock chamber comprising: 
 a chamber body having a first and second substrate access port;    a first plurality of support pins disposed in the chamber body and arranged to support a first substrate thereon;    a second plurality of support pins disposed in a chamber body and arranged to support a second substrate thereon; and    a cooling plate disposed in the chamber body below the first plurality of support pins, wherein a distance between substrate supporting ends of the second plurality of support pins and the cooling plate are adjustable.    
   
   
       2 . The load lock chamber of  claim 1 , wherein cooling plate further comprises: 
 a plurality of holes through with the second plurality of support pins are disposed.    
   
   
       3 . The loadlock of  claim 1 , wherein the first plurality of support pins are moveable relative to the cooling plate.  
   
   
       4 . The loadlock of  claim 1 , wherein the cooling plate is positioned to accept a processed substrate from the second plurality of support pins.  
   
   
       5 . The loadlock of  claim 1 , wherein the cooling plate includes at least one groove on its surface for receiving a portion of a robotic end effector.  
   
   
       6 . The loadlock of  claim 1 , wherein the cooling plate further includes at least one coolant carrying channel.  
   
   
       7 . The loadlock of  claim 1 , further comprising an elevator to control the vertical position of the first and second plurality of support pins.  
   
   
       8 . The loadlock of  claim 1 , further comprising a heating device disposed above the upper structure.  
   
   
       9 . The loadlock of  claim 1  further comprising: 
 a lift plate located below the cooling plate and moveable to actuate the second plurality of support pins.    
   
   
       10 . A loadlock comprising: 
 a chamber body;    a first plurality of support pins in the chamber body and arranged to support a first substrate;    a second plurality of support pins disposed in the chamber body above the first plurality of support pins, the second first plurality of support pins moveable to a first position selected to support a first substrate;    an elevator for controlling a vertical position of the second plurality of support pins;    a cooling plate including a surface adapted to support the first substrate thereon when the second plurality of support pins are in a second position; and    a heating device located above the first plurality of support pins.    
   
   
       11 . The loadlock of  claim 10 , wherein the second plurality of support pins extends through the cooling plate when in the first position.  
   
   
       12 . The loadlock of  claim 10 , wherein the cooling plate is attached to the chamber body.  
   
   
       13 . The loadlock of  claim 10  further comprising: 
 a middle plate between the first and second plurality of support pins.    
   
   
       14 . A method for processing substrates comprising: 
 delivering an unprocessed substrate to first substrate slot defined in a loadlock chamber;    pumping down the load lock chamber while the unprocessed substrate is in the first substrate slot;    delivering the unprocessed substrate to a chamber outside of the loadlock chamber;    delivering a processed substrate from the chamber outside of the loadlock to a second substrate slot defined in the loadlock chamber, the second substrate slot having a height; and    reducing the height of the second substrate slot while the processed substrate is in the second substrate slot; and    cooling the processed substrate while the processed substrate is in the reduced height second substrate slot.    
   
   
       15 . A method for processing substrates comprising: 
 delivering an unprocessed substrate to an upper support structure in a loadlock chamber through a first opening in the loadlock;    closing the first opening and evacuating the loadlock chamber;    delivering the unprocessed substrate to a chamber outside of the loadlock chamber through a second opening in the loadlock;    delivering a processed substrate from the chamber outside of the loadlock chamber to the lower support structure through the second opening in the loadlock chamber; and    delivering the processed substrate to a cooling plate in the loadlock chamber.    
   
   
       16 . The method of  claim 16 , wherein delivering the processed substrate to the cooling plate comprises: 
 lowering the lower support structure relative to the cooling plate.    
   
   
       17 . The method of  claim 16 , further comprising: 
 cooling the substrate on the cooling plate;    raising the lower support structure relative to the cooling plate to remove the processed substrate from the cooling plate; and    removing the processed substrate from the loadlock through the first opening.    
   
   
       18 . The method of  claim 16 , further comprising: 
 heating the processed substrate in the loadlock prior to venting the loadlock chamber.    
   
   
       19 . The method of  claim 16 , further comprising: 
 lowering the lower support structure relative to the first opening after removing the processed substrate from the loadlock chamber through the first opening; and    aligning the upper support structure to accept an unprocessed substrate on upper support structure through the first opening.    
   
   
       20 . The method of  claim 16 , wherein the upper and lower support structure move together relative the cooling place.