Frame packaged array electronic component

Abstract

The present invention uses a frame with one or more axial ribs extending from a spine onto which two or more discrete two-terminal electronic components, such as capacitors, resistors, or inductors, can be attached. The function of the frame is to align and space the electronic components in a single device or array that allows the two-terminals of each component to be separately contacted or soldered to a PC board during final assembly into a circuit. The frame may use friction or a bonding agent to hold the components to the frame. Additionally, the base of the frame forms a single surface for the pick and place equipment used in circuit board assembly. The frame and any bonding agent must be capable of sustaining high temperature soldering operations to form electrical contacts in the circuit assembly operation.

1 . A frame packaged array device for holding a plurality of electronic components comprising: 
 an elongated spine; and    one or more ribs protruding axially from one side of the spine allowing the plurality of components to locate adjacent the spine and adjacent the one or more ribs for attaching the components to a circuit board.    
     
     
         2 . The array device of  claim 1  constructed from plastic.  
     
     
         3 . The array device of  claim 1  configured for holding surface mount electronic devices.  
     
     
         4 . The array device of  claim 1  configured to frictionally hold the components.  
     
     
         5 . A frame packaged array device for holding a plurality of electronic components comprising: 
 an array frame having an elongated spine and one or more ribs protruding axially from the spine; and    a plurality of electronic components attached to the array frame and located adjacent the spine and adjacent the one or more ribs for attaching the components to a circuit board.    
     
     
         6 . The array device of  claim 5  wherein the plurality of electronic components are selected from the group consisting of capacitors, resistors and inductors.  
     
     
         7 . The array device of  claim 5  having a bonding agent for attaching the electronic components to the array frame.  
     
     
         8 . A frame packaged array device for holding a plurality of electronic components comprising: 
 an electronic device array having an array frame with a spine, one or more ribs protruding axially from the spine, and a plurality of electronic components attached to the array frame and located adjacent the spine and adjacent the one or more ribs;    a printed circuit board; and    one or more of the electronic components electrically connected to the circuit board.    
     
     
         9 . The array device of  claim 8  wherein the electronic components are surface mounted devices.  
     
     
         10 . A method of making a frame packaged array device for holding a plurality of electronic components comprising: 
 selecting electronic components to include in the array device; and    attaching the electronic components to an array frame, where the array frame has an elongated spine and one or more ribs protruding axially from one side of the spine so that the electronic components can be electrically connected to a printed circuit board.    
     
     
         11 . The method of  claim 10  further comprising testing the electronic components.  
     
     
         12 . The method of  claim 10  further comprising applying a bonding agent to hold the electronic components in place on the array frame.  
     
     
         13 . The method of  claim 10  further comprising arranging and packaging the array assembly for automated placement onto circuit boards.  
     
     
         14 . The method of  claim 10  further comprising electrically attaching the electronic components to the printed circuit board.