De-coupling capacitors produced by utilizing dummy conductive structures integrated circuits

Abstract

A de-coupling capacitor module using dummy conductive elements in an integrated circuit is disclosed. The de-coupling module comprises at least one circuit module having one or more active nodes, and at least one dummy conductive element unconnected to any active node, and separated from a high voltage conductor or a low voltage conductor by an insulation region to provide a de-coupling capacitance.

1 . A de-coupling capacitor module in an integrated circuit comprising: 
 at least one circuit module having one or more active nodes;    one or more dummy conductive elements unconnected to any active node; and    one or more high voltage conductor or a low voltage conductor separated by an insulation region from at least one of the dummy conductive elements to provide a de-coupling capacitance,    wherein the dummy conductive elements are substantially parallel among themselves and located in an area unoccupied by one or more circuit components connected to the active nodes.    
   
   
       2 . The de-coupling module of  claim 1  wherein the high voltage conductor, the low voltage conductor, and the dummy conductive element are formed on the same metal layer of the integrated circuit.  
   
   
       3 . The de-coupling module of  claim 1  wherein the high voltage conductor, the low voltage conductor, and the dummy conductive element are formed on two or more different metal layers of the integrated circuit.  
   
   
       4 . The de-coupling module of  claim 1  wherein the dummy conductive element is connected to a voltage different from that of either the high or low voltage conductor that is immediately adjacent to it for providing a de-coupling capacitance.  
   
   
       5 . The de-coupling module of  claim 1  wherein the dummy conductive element comprises a first set of interconnected conductive units running substantially parallel to the high voltage conductor or the low voltage conductor, and a second set of interconnected conductive units running substantially parallel and close to the first set of interconnected conductive units, wherein the second set of interconnected conductive units has a voltage different from that of the first set of interconnected conductive units for providing a de-coupling capacitance therebetween.  
   
   
       6 . The de-coupling module of  claim 5  wherein the first and second sets of interconnected conductive units are on a same layer.  
   
   
       7 . The de-coupling module of  claim 5  wherein the first and second sets of interconnected conductive units are on two different layers immediately adjacent to each other.