US2007110839A1PendingUtilityA1

Resin-sealing and molding apparatus of optical device

Assignee: TAKASE SHINJIPriority: Jul 12, 2005Filed: Jan 12, 2007Published: May 17, 2007
Est. expiryJul 12, 2025(expired)· nominal 20-yr term from priority
H10W 74/00B29C 41/20B29C 41/36B29C 70/70B29D 11/0074B29C 31/008B29C 39/10B29L 2031/747B29C 33/68B29C 37/0075B29C 41/42B29C 31/08
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Claims

Abstract

There is provided a method of sealing and molding an optical device with resin by employing a die including a top piece, a bottom piece, an intermediate piece, and a mold release film pinched between the bottom and intermediate pieces and thus tensioned as prescribed to cover the bottom piece's cavity, when the bottom piece is heated, and the mold release film expands and thus closely contacts the cavity's entire surface along the cavity's geometry so that the optical device can be sealed in transparent set resin shaped as desired.

Claims

exact text as granted — not AI-modified
1 . A resin-sealing and molding apparatus of an optical device, comprising: 
 a first molding die;    a second molding die having a cavity and being opposite to said first molding die; and    a third molding die arranged between said first and second molding dies, wherein    said first molding die has a substrate bearing portion to which a substrate before sealing, on which said optical device is mounted, is attached,    said second molding die has a sandwiching member for sandwiching a mold release film supplied between said second molding die and said third molding die and a cavity member forming a part of said cavity, wherein    said mold release film is sandwiched between said sandwiching member and said third molding die, and is brought into contact with a cavity's entire surface, and melted resin or resin in from of liquid is cured in said cavity with which said mold release film is in contact, and thereby, said optical device is sealed.    
   
   
       2 . The resin-sealing and molding apparatus of the optical device according to  claim 1 , wherein 
 said mold is provided with a film aspiration mechanism for bringing said mold release film into contact with said cavity's entire surface by aspirating said mold release film.    
   
   
       3 . The resin-sealing and molding apparatus of the optical device according to  claim 1 , wherein 
 said second mold is provided with an air blow system for bringing said mold release film into contact with said cavity's entire surface by blowing air against said mold release film.    
   
   
       4 . The resin-sealing and molding apparatus of the optical device according to  claim 1 , wherein 
 said mold release film is brought into contact with said cavity's entire surface by heating said second molding die.    
   
   
       5 . The resin-sealing and molding apparatus of the optical device according to  claim 1 , wherein 
 said cavity has a plurality of curved portions each corresponding to said optical device, and said curved portions are communicated with each other.    
   
   
       6 . The resin-sealing and molding apparatus of the optical device according to  claim 1 , further comprising: 
 a seal member for forming a space isolated from external atmosphere by sealing the clearance between said first mold and said third mold, and a suction and exhaust hole provided so as to be able to vacuum said space isolated from external atmosphere.

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