Inventor · disambiguated record
Yohei Onishi
Also filed as: ONISHI YOHEI
10 granted patents·8 pending applications·26 citations·filing 2003–2023
85Inventor score
Top patents by PatentIndex Score
18 records- 0175US7811491B2Method for manufacturing optical electronic componentTOWA CORP·Filed 2005·Granted Oct 12, 2010·6 cites·4 claims
- 0268US8696951B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Apr 15, 2014·4 cites·10 claims
- 0363US11712823B2Molding die for compression molding with resin leakage prevention memberTOWA CORP·Filed 2021·Granted Aug 1, 2023·0 cites·9 claims
- 0463US7985357B2Method of resin-sealing and molding an optical deviceTOWA CORP·Filed 2006·Granted Jul 26, 2011·2 cites·6 claims
- 0562US10170346B2Resin sealing apparatus and resin sealing methodTOWA CORP·Filed 2016·Granted Jan 1, 2019·2 cites·16 claims
- 0661US8193558B2Optical electronic componentTAKASE SHINJI·Filed 2008·Granted Jun 5, 2012·2 cites·2 claims
- 0757US6929977B2Method of introducing resin for electronic component and apparatus used thereforTOWA CORP·Filed 2003·Granted Aug 16, 2005·8 cites·7 claims
- 0853US2024009899A1Compression mold, resin molding apparatus, resin molding system, and method of manufacturing resin-molded productTOWA CORP·Filed 2021·Application pending·0 cites
- 0952US11833722B2Resin molding apparatus and method of manufacturing resin molded productTOWA CORP·Filed 2021·Granted Dec 5, 2023·0 cites·10 claims
- 1052US2025319638A1Resin molding apparatus and method for producing resin molded productTOWA CORP·Filed 2023·Application pending·0 cites
- 1147US8771563B2Manufacturing method of optical electronic components and optical electronic components manufactured using the sameTAKASE SHINJI·Filed 2007·Granted Jul 8, 2014·0 cites·10 claims
- 1246US7618573B2Resin sealing method for electronic part and mold used for the methodTOWA CORP·Filed 2004·Granted Nov 17, 2009·2 cites·1 claims
- 1346US2007110839A1Resin-sealing and molding apparatus of optical deviceTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 1446US2022055261A1Resin molding apparatus and manufacturing method of resin molded productTOWA CORP·Filed 2021·Application pending·0 cites
- 1542US2009102093A1Method of sealing and molding electronic component with resin and moldTOKUYAMA HIDEKI·Filed 2008·Application pending·0 cites
- 1640US2009291532A1Method of resin encapsulation molding for electronic partTAKASE SHINJI·Filed 2007·Application pending·0 cites
- 1740US2007085237A1Resin sealing and molding method of electronic componentTOWA CORP·Filed 2006·Application pending·0 cites
- 1835US2016151946A1Molded article production system and molded article production methodTOWA CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →