Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the same

Abstract

The present invention is related to a printed circuit board having embedded capacitors using a hybrid material and a method of manufacturing the same. This invention provides a printed circuit board having embedded capacitors using a material for a hybrid dielectric layer including liquid crystal polymer and ceramic powder, and a method of manufacturing such a printed circuit board.

1 . A printed circuit board having embedded capacitors using a hybrid material, comprising: 
 a double-sided copper clad laminate having upper and lower copper foil layers, one of the upper and lower copper foil layers is formed into a first circuit layer having circuit patterns, the other copper foil layer is formed into a fourth circuit layer having circuit patterns;    a hybrid copper clad laminate, including a hybrid dielectric layer containing liquid crystal polymer and ceramic powder and copper foils laminated on both upper and lower surfaces thereof, one of the upper and lower copper foils of the hybrid copper clad laminate being formed into a second circuit layer having lower electrodes and circuit patterns, the other copper foil thereof being formed into a third circuit layer having upper electrodes and circuit patterns, in which the second circuit layer and third circuit layer are formed such that the lower electrodes of the second circuit layer correspond to the upper electrodes of the third circuit layer;    an insulating layer disposed between the double-sided copper clad laminate and the hybrid copper clad laminate to be laminated so as to position the first circuit layer and the second circuit layer as inner layers facing each other;    single-sided copper clad laminates laminated on the third circuit layer and fourth circuit layer, respectively;    a blind via hole and a through hole formed in predetermined portions of the single-sided copper clad laminates; and    a plating layer plated in the blind via hole and through hole.    
   
   
       2 . The printed circuit board as set forth in  claim 1 , wherein the liquid crystal polymer has a dielectric constant of 3.5 or less and a dissipation factor of 0.0007-0.002.  
   
   
       3 . The printed circuit board as set forth in  claim 1 , wherein the ceramic powder has a dielectric constant of 5-120 and Q•f of 1,000-150,000.  
   
   
       4 . The printed circuit board as set forth in  claim 1 , wherein the ceramic powder is BaTiO 3 —TiO 2 , ZnO—MgO—SiO 2 , CaCO 3 —TiO 2 —MgO, BaO—MgO—Ta 2 O 5 , ZrO 2 —SnO 2 —TiO 2 , BaO—ZnO—Ta 2 O 5 , CaCO 3 —TiO 2 —Nd 2 O 3 —Li 2 CO 3 , BaTiO 3 —TiO 2 —Nd 2 O 3 —Sm 2 O 3 —Bi 2 O 3 , or CaCO 3 —TiO 2 —La 2 O 3 —Al 2 O 3 .  
   
   
       5 . The printed circuit board as set forth in  claim 1 , wherein the ceramic powder has an average particle size of 0.5-2 μm.  
   
   
       6 . The printed circuit board as set forth in  claim 1 , wherein the ceramic powder is contained in the dielectric layer in an amount of 5-55 vol %.  
   
   
       7 . The printed circuit board as set forth in  claim 1 , wherein the dielectric layer is 10-300 μm thick.  
   
   
       8 . The printed circuit board as set forth in  claim 1 , wherein a layer including the dielectric layer functions as a capacitor for signal matching or impedance matching.  
   
   
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