Inventor · disambiguated record
Jun Rok Oh
Also filed as: OH JUN R · OH JUN-ROK
13 granted patents·21 pending applications·112 citations·filing 2005–2024
90Inventor score
Top patents by PatentIndex Score
34 records- 0195US7186919B2Printed circuit board including embedded capacitors and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 6, 2007·39 cites·4 claims
- 0290US7281321B2Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2006·Granted Oct 16, 2007·20 cites·11 claims
- 0389US7618553B2Insulating material for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Granted Nov 17, 2009·19 cites·6 claims
- 0484US8101248B2Composition for forming substrate, and prepreg and substrate using the sameYUN GEUM HEE·Filed 2010·Granted Jan 24, 2012·7 cites·19 claims
- 0579US8105663B2Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2009·Granted Jan 31, 2012·6 cites·21 claims
- 0679US8043876B2Light emitting diode package and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Granted Oct 25, 2011·9 cites·17 claims
- 0770US8053673B2Capacitor embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 8, 2011·4 cites·9 claims
- 0868US7913368B2Method of manufacturing chip capacitor including ceramic/polymer compositeSAMSUNG ELECTRO MECH·Filed 2009·Granted Mar 29, 2011·5 cites·9 claims
- 0965US7676921B2Method of manufacturing printed circuit board including embedded capacitorsSAMSUNG ELECTRO MECH·Filed 2007·Granted Mar 16, 2010·3 cites·5 claims
- 1063US11541634B2Graphite sheet and method for manufacturing sameSKC CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·6 claims
- 1161US2024387342A1Substrate with embedded elements and manufacturing method of the sameABSOLICS INC·Filed 2024·Application pending·0 cites
- 1257US2024162167A1Substrate and semiconductor moduleABSOLICS INC·Filed 2023·Application pending·0 cites
- 1352US2010270064A1Resin composition for printed circuit board and printed circuit board using the sameCHO JAE CHOON·Filed 2009·Application pending·0 cites
- 1451US2007125574A1Printed circuit board having embedded capacitors using hybrid material and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 1551US2009288863A1Glass composition with low coefficient of thermal expansion, glass fiber, insulating layer of printed circuit board and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 1650US2020051793A1Ring-shaped element for etcher and method for etching substrate using the sameSKC SOLMICS CO LTD·Filed 2019·Application pending·0 cites
- 1749US8829155B2Poly(p-xylylene)-based polymer having low dielectric constant and low-loss property and insulating material, printed circuit board and functional element using the sameCHO JAE-CHOON·Filed 2009·Granted Sep 9, 2014·0 cites·6 claims
- 1849US2010063226A1Norbornene-based polymer having low dielectric constant and low-loss properties, and insulating material, printed circuit board and function element using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1948US2009128174A1Probe card using thermoplastic resinSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2048US2010270065A1Resin Composition For Printed Circuit Board and Printed Circuit Board Using The SameCHO JAE CHOON·Filed 2009·Application pending·0 cites
- 2148US2010210803A1Norbornene-based polymer having low dielectric constant and low-loss properties and insulating material using the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2248US2009262520A1Backlight unit using a thermoplastic resin boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2348US2009168449A1Light emitting diode unitSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2447US2008242787A1Eucryptite ceramic filler and insulating composite material containing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2545US11040516B2Graphite sheet and method for manufacturing sameSKC CO LTD·Filed 2016·Granted Jun 22, 2021·0 cites·4 claims
- 2645US2009106977A1Manufacturing method of printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 2745US2009072207A1Flame retardant resin composition for printed circuit board, printed circuit board using the same and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2845US2006246284A1Fabric reinforcement using modified cyclic olefin copolymer and resin substrate for printed circuit boardSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 2944US2009141481A1Array light source using led and backlight unit including the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3041US2020062654A1Boron carbide sintered body and etcher including the sameSKC SOLMICS CO LTD·Filed 2019·Application pending·0 cites
- 3140US10968390B2Composition for semiconductor process and semiconductor processSKC CO LTD·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 3239US2010255742A1Heat Radiation Substrate and Illumination Module Substrate Having Hybrid LayerYUN GEUM HEE·Filed 2009·Application pending·0 cites
- 3336US2019276778A1Composition for semiconductor process and semiconductor processSKC CO LTD·Filed 2019·Application pending·0 cites
- 3435US2011172357A1Composition for forming substrate, and prepreg and substrate using the sameLEE KEUN YONG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →