Methods and apparatus for creating a high speed connection between a device under test and automatic test equipment

Abstract

Methods and apparatus are described for aligning a probe card with a wafer probe interface by bringing first kinematic features into contact with second kinematic features, thereby restraining relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.

1 . A method for aligning a probe card with a wafer probe interface, comprising bringing first kinematic features into contact with second kinematic features, thereby restraining relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.  
   
   
       2 . The method of  claim 1  wherein the first kinematic features are associated with the probe card and the second kinematic features are associated with the wafer probe interface.  
   
   
       3 . The method of  claim 1  wherein the first and second kinematic features comprise substantially spherical surfaces and channels configured to receive the substantially spherical surfaces.  
   
   
       4 . The method of  claim 1  wherein the first and second kinematic features comprise substantially spherical surfaces and substantially planar surfaces configured to receive the substantially spherical surfaces.  
   
   
       5 . A probe card for facilitating testing of a wafer in conjunction with a wafer probe interface, the probe card comprising: 
 a probe card structure;    a probe contact array disposed on the probe card structure; and    first kinematic features disposed on the probe card structure, the first kinematic features being operable together with second kinematic features associated with the wafer probe interface to restrain relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.    
   
   
       6 . The probe card of  claim 5  wherein the first kinematic features comprise substantially spherical surfaces and the second kinematic features comprise channels configured to receive the substantially spherical surfaces.  
   
   
       7 . The probe card of  claim 5  wherein the first kinematic features comprise substantially spherical surfaces and the second kinematic features comprise substantially planar surfaces configured to receive the substantially spherical surfaces.  
   
   
       8 . The probe card of  claim 5  wherein the second kinematic features comprise substantially spherical surfaces and the first kinematic features comprise channels configured to receive the substantially spherical surfaces.  
   
   
       9 . The probe card of  claim 5  wherein the second kinematic features comprise substantially spherical surfaces and the first kinematic features comprise substantially planar surfaces configured to receive the substantially spherical surfaces.  
   
   
       10 . A wafer probe interface for facilitating testing of a wafer in conjunction with a probe card, the wafer probe interface comprising 
 a wafer probe interface structure;    a test signal contact array disposed on the wafer probe interface structure; and    first kinematic features disposed on the wafer probe interface structure, the first kinematic features being operable together with second kinematic features to restrain relative motion between the probe card and the wafer probe interface when the probe card and the wafer probe interface are docked.    
   
   
       11 . The wafer probe interface of  claim 10  wherein the second kinematic features are associated with the probe card.  
   
   
       12 . The wafer probe interface of  claim 10  wherein the first kinematic features comprise substantially spherical surfaces and the second kinematic features comprise channels configured to receive the substantially spherical surfaces.  
   
   
       13 . The wafer probe interface of  claim 10  wherein the first kinematic features comprise substantially spherical surfaces and the second kinematic features comprise substantially planar surfaces configured to receive the substantially spherical surfaces.  
   
   
       14 . The wafer probe interface of  claim 10  wherein the second kinematic features comprise substantially spherical surfaces and the first kinematic features comprise channels configured to receive the substantially spherical surfaces.  
   
   
       15 . The wafer probe interface of  claim 10  wherein the second kinematic features comprise substantially spherical surfaces and the first kinematic features comprise substantially planar surfaces configured to receive the substantially spherical surfaces.