Method of forming a non-continuous conductive layer for laminated substrates

Abstract

A method of fabricating a circuit board is provided that includes forming a first layer of conductive material over an insulating layer, removing portions of the conductive material to define a first circuit pattern and a first rail area that is electrically isolated from the first circuit pattern, and removing portions of the conductive material from the first rail area. Optionally, the first rail area is positioned generally adjacent to a first edge of the circuit board and spans at least a portion of the length of the first edge. Optionally, portions of the conductive material of the first layer are removed to define a second rail area that is electrically isolated from the first circuit pattern and the first rail area, and portions of the conductive material of the first layer are also removed from the second rail area.

1 . A method of fabricating a memory device on a laminated circuit board wherein the laminated circuit board has a length, a width and a thickness, the method comprising: 
 laminating a metal layer to an insulating layer;    removing metal from the metal layer to define conductive paths, bonding pads, and rails, said rails defined along at least a portion of the edges of the length of the circuit board where no metal has been removed, said rails electrically isolated from said conductive paths and bonding pads; and,    etching the rails to remove metal therefrom.    
   
   
       2 . The method of  claim 1 , wherein etching the rails includes removing all metal from the rails.  
   
   
       3 . A method of fabricating a memory device on a laminated circuit board, wherein the laminated circuit board has a length, a width and a thickness comprising: 
 laminating a first metal layer to a first side of an insulating layer;    laminating a second metal layer to a second side of an insulating layer;    etching conductive paths and bonding pads onto the first metal layer to define at least one first side die site and at least one first side rail wherein said first side rail comprises a continuous strip of said first metal layer that is electrically isolated from said at least one first side die site;    etching conductive paths and bonding pads onto the second metal layer to define at least one second side die site and at least one second side rail, wherein said second side rail comprises a continuous strip of said second metal layer that is electrically isolated from said at least one second side die site; and,    etching either said at least one first side rail, said at least one second side rail, or both said at least one first side rail and said at least one second side rail to remove at least a portion of the metal.    
   
   
       4 . The method of  claim 3 , wherein etching conductive paths and bonding pads onto the first metal layer for at least one first side die site comprises removing metal from the first metal layer, resulting in forming rails along edges of the length of the first metal layer where the rails have no metal removed and wherein etching conductive paths and bonding pads onto the second metal layer for at least one second side die site comprises removing metal from the metal layer, resulting in forming rails along edges of the length of the second metal layer where the rails have no metal removed.  
   
   
       5 . The method of  claim 3 , wherein etching the rails comprises removing sections of metal from the rails.  
   
   
       6 . The method of  claim 3 , wherein etching the rails comprises removing all metal from the rails.  
   
   
       7 . A method of forming a circuit board comprising: 
 forming a circuit board having an insulating layer sandwiched between a first conductive layer and a second conductive layer;    etching said first conductive layer defining a first site comprising a first patterned area of conductive traces, and a first generally rectangular rail extending adjacent to a first edge of said first conductive layer spanning substantially the length thereof, said first rail electrically isolated from said first patterned area and comprises gaps etched into said first conductive layer; and,    etching said second conductive layer defining a second site comprising a second patterned area of conductive traces, a third generally rectangular rail extending adjacent to a first edge of said second conductive layer spanning substantially the length thereof, and a fourth generally rectangular rail extending adjacent to a second edge of said second conductive layer spanning substantially the length thereof, said third and fourth rails electrically isolated from said second patterned area and comprise gaps etched into said second conductive layer.    
   
   
       8 . A method of forming a circuit board according to  claim 7 , further comprising: 
 a second generally rectangular rail extending adjacent to a second edge of said first conductive layer spanning substantially the length thereof, said second rail electrically isolated from said first patterned area and comprises gaps etched into said first conductive layer.