Inventor · disambiguated record
Patrick W. Tandy
Also filed as: TANDY PATRICK W
42 granted patents·4 pending applications·2,043 citations·filing 1997–2011
99Inventor score
Top patents by PatentIndex Score
46 records- 0199US8036629B2Methods of operating electronic devices, and methods of providing electronic devicesROUND ROCK RES LLC·Filed 2010·Granted Oct 11, 2011·72 cites·13 claims
- 0299US7778621B2Methods of operating electronic devices, and methods of providing electronic devicesROUND ROCK RES LLC·Filed 2007·Granted Aug 17, 2010·75 cites·34 claims
- 0399US7593708B2Methods of operating electronic devices, and methods of providing electronic devicesKEYSTONE TECHNOLOGY SOLUTIONS·Filed 2006·Granted Sep 22, 2009·81 cites·40 claims
- 0499US5986209APackage stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 16, 1999·399 cites·14 claims
- 0598US6718163B2Methods of operating microelectronic devices, and methods of providing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 6, 2004·116 cites·35 claims
- 0698US6265660B1Package stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 24, 2001·106 cites·2 claims
- 0798US6212767B1Assembling a stacked die packageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 10, 2001·271 cites·19 claims
- 0896US7107019B2Methods of operating microelectronic devices, and methods of providing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 12, 2006·81 cites·35 claims
- 0995US6542720B1Microelectronic devices, methods of operating microelectronic devices, and methods of providing microelectronic devicesMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 1, 2003·129 cites·31 claims
- 1095US6331453B1Method for fabricating semiconductor packages using mold tooling fixture with flash control cavitiesMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 18, 2001·154 cites·25 claims
- 1195US6210992B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 3, 2001·172 cites·18 claims
- 1292US6577004B1Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2000·Granted Jun 10, 2003·75 cites·46 claims
- 1387US6660558B1Semiconductor package with molded flashMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 9, 2003·39 cites·16 claims
- 1482US6146919APackage stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Nov 14, 2000·36 cites·11 claims
- 1581US6521980B1Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·25 cites·12 claims
- 1679US6899534B2Mold assembly for a package stack via bottom-leaded plastic (blp) packagingMICRON TECHNOLOGY INC·Filed 2003·Granted May 31, 2005·14 cites·6 claims
- 1778US7094046B2Mold assembly for a package stack via bottom-leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 22, 2006·4 cites·6 claims
- 1876US6429385B1Non-continuous conductive layer for laminated substratesMICRON TECHNOLOGY INC·Filed 2000·Granted Aug 6, 2002·13 cites·23 claims
- 1974US6140695ACompression layer on the leadframe to reduce stress defectsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 31, 2000·29 cites·30 claims
- 2069US6499213B2Assembling a stacked die packageMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 31, 2002·10 cites·3 claims
- 2168US6403457B2Selectively coating bond padsMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 11, 2002·23 cites·10 claims
- 2266US6914326B2Solder ball landpad design to improve laminate performanceMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 5, 2005·11 cites·24 claims
- 2365US6395579B2Controlling packaging encapsulant leakageMICRON TECHNOLOGY INC·Filed 2001·Granted May 28, 2002·10 cites·9 claims
- 2464US6729024B2Method of forming a non-continuous conductive layer for laminated substratesMICRON TECHNOLOGY INC·Filed 2001·Granted May 4, 2004·6 cites·12 claims
- 2562US6537051B2Encapsulation mold with a castellated inner surfaceMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 25, 2003·5 cites·3 claims
- 2662US6166328APackage stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Dec 26, 2000·14 cites·2 claims
- 2761US6553658B2Assembling a stacked die packageMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 29, 2003·6 cites·10 claims
- 2860US6188021B1Package stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Feb 13, 2001·13 cites·8 claims
- 2957US6392289B1Integrated circuit substrate having through hole markings to indicate defective/non-defective status of sameMICRON TECHNOLOGY INC·Filed 1999·Granted May 21, 2002·17 cites·24 claims
- 3056US6213747B1Package stack via bottom leaded plastic (BLP) packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 10, 2001·10 cites·3 claims
- 3153US6486539B1Compression layer on the leadframe to reduce stress defectsMICRON TECHNOLOGY INC·Filed 2000·Granted Nov 26, 2002·3 cites·31 claims
- 3253US5923081ACompression layer on the leadframe to reduce stress defectsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 13, 1999·12 cites·19 claims
- 3349US8554166B2Methods of operating electronic devices, and methods of providing electronic devicesTANDY PATRICK W·Filed 2011·Granted Oct 8, 2013·0 cites·18 claims
- 3449US2007134952A1Method of forming a non-continuous conductive layer for laminated substratesTANDY PATRICK W·Filed 2007·Application pending·0 cites
- 3545US7216425B2Method of forming a non-continuous conductive layer for laminated substratesMICRON TECHNOLOGY INC·Filed 2004·Granted May 15, 2007·0 cites·7 claims
- 3645US6404216B1Test contactMICRON TECHNOLOGY INC·Filed 1999·Granted Jun 11, 2002·11 cites·20 claims
- 3745US2006118938A1Mold assembly, method and a package stack via bottom-leaded plastic (BLP) packagingTANDY PATRICK W·Filed 2006·Application pending·0 cites
- 3843US2006030147A1Selectively coating bond padsTANDY PATRICK W·Filed 2005·Application pending·0 cites
- 3942US6998714B2Selectively coating bond padsMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 14, 2006·0 cites·19 claims
- 4042US6727437B2Non-continuous conductive layer for laminated substratesMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 27, 2004·0 cites·42 claims
- 4142US6658727B2Method for assembling die packageMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 9, 2003·0 cites·7 claims
- 4242US6657288B2Compression layer on the lead frame to reduce stress defectsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 2, 2003·0 cites·31 claims
- 4340US6756606B2Apparatus and method for marking defective sections of laminate substratesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 29, 2004·0 cites·40 claims
- 4440US2001002734A1Selectively coating bond padsFiled 2001·Application pending·0 cites
- 4539US7951646B2Solder ball landpad design to improve laminate performanceROUND ROCK RES LLC·Filed 2003·Granted May 31, 2011·0 cites·21 claims
- 4632US6221695B1Method for fabricating a compression layer on the dead frame to reduce stress defectsMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·1 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →