Stackable molded packages and methods of making the same

Abstract

A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.

1 . A method for forming a packaged integrated circuit (IC) comprising: 
 providing a package substrate having a first surface, a first IC die attached to the first surface, a plurality of conductive members on the first surface at least partially surrounding the first IC die and electrically connected to the first IC die, and a dam on the first surface at least partially surrounding the plurality of conductive members; and    performing a surface fill by providing an encapsulant to the first surface of the package substrate wherein the encapsulant surrounds the first IC die and is at least partially contained by the dam and wherein portions of each of the plurality of conductive members remain exposed during the surface fill.    
     
     
         2 . The method of  claim 1 , wherein the package substrate has a second surface, opposite the first surface, the second surface having a plurality of external conductive members.  
     
     
         3 . The method of  claim 1 , wherein the package substrate has a second IC die over the first surface.  
     
     
         4 . The method of  claim 3 , wherein the second IC die is over the first IC die.  
     
     
         5 . The method of  claim 1 , wherein the first IC die is attached to the first surface with a plurality of wirebonds.  
     
     
         6 . The method of  claim 1 , wherein the first IC die is attached to the first surface with a plurality of conductive bumps.  
     
     
         7 . The method of  claim 6 , wherein providing the encapsulant to the first surface comprises providing the encapsulant as an underfill between the first IC die and the first surface.  
     
     
         8 . The method of  claim 1 , wherein the dam completely surrounds the plurality of conductive members together with the first IC die.  
     
     
         9 . The method of  claim 1 , wherein the package substrate further comprises a shielding support on the first surface for mounting a shield.  
     
     
         10 . The method of  claim 9 , wherein the shielding support is at least one of a radio frequency shield or an electromagnetic interference shield.  
     
     
         11 . A method for forming a packaged integrated circuit (IC) comprising: 
 providing a package substrate having a first surface, a first IC die attached to the first surface, a plurality of conductive members on the first surface at least partially surrounding the first IC die and electrically connected to the first IC die;    providing a protection plate in physical contact with a top portion of each of the plurality of conductive members;    providing an encapsulant onto the first surface of the package substrate, wherein the encapsulant surrounds the first IC die and each of the plurality of conductive members, and wherein the protection plate remains in physical contact with the top portion of each of the plurality of conductive members during the providing the encapsulant; and    removing the protection plate, wherein after removing the protection plate, the top portion of each of the plurality of conductive members remains exposed.    
     
     
         12 . The method of  claim 11 , wherein the protection plate includes a plurality of indentations for receiving a corresponding top portion of the plurality of conductive members.  
     
     
         13 . The method of  claim 11 , wherein providing the protection plate further comprises: 
 providing, a mold chase having the protection plate therein over the package substrate, the protection plate moveable inside the mold chase; and    applying a force to bring the protection plate into physical contact with the top portion of each of the plurality of conductive members.    
     
     
         14 . The method of  claim 13 , wherein the mold chase comprises a spring between the mold chase and the protection plate to apply the force.  
     
     
         15 . The method of  claim 11 , wherein the package substrate has a second IC die over the first surface.  
     
     
         16 . The method of  claim 11 , wherein the first IC die is attached to the first surface using at least one of a plurality of wirebonds and a plurality of conductive bumps.  
     
     
         17 . A method for forming a packaged integrated circuit (IC) comprising: 
 providing a package substrate having a first surface, a first IC die attached to the first surface, a plurality of conductive pads on the first surface at least partially surrounding the first IC die and electrically connected to the first IC die;    providing a plurality of pad protectors into physical contact with the plurality of conductive pads, wherein each pad protector of the plurality of pad protectors is in physical contact with a corresponding conductive pad of the plurality of conductive pads;    providing an encapsulant onto the first surface of the package substrate, wherein the encapsulant surrounds the first IC die and at least a portion of a housing for each of the plurality of pad protectors; and    after the providing the encapsulant, removing the plurality of pad protectors, wherein after the removing the plurality of pad protectors, at least a portion of each conductive pad of the plurality of conductive pads is exposed by an opening in the encapsulant.    
     
     
         18 . The method of  claim 17 , further comprising: 
 after the removing the plurality of pad protectors, filling at least a portion of each opening in the encapsulant with a conductive material.    
     
     
         19 . The method of  claim 17 , wherein the providing the plurality of pad protectors comprises applying a vacuum through each of the plurality of pad protectors.  
     
     
         20 . The method of  claim 17 , wherein the providing the plurality of pad protectors comprises applying a force to maintain the plurality of pad protectors in physical contact with the plurality of conductive pads, and wherein during the providing the encapsulant, applying at least one of a positive pressure and a negative pressure through each of the plurality of pad protectors.  
     
     
         21 . A packaged integrated circuit (IC) system comprising: 
 a first packaged IC having a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant; and    a second packaged IC stacked onto the first packaged IC, the second packaged IC having at least one IC die and a plurality of conductive members electrically connected to the at least one IC die of the second packaged IC, each conductive member of the plurality of conductive members of the second packaged IC in contact with a corresponding conductive member of the plurality of conductive members of the first packaged IC.    
     
     
         22 . The packaged IC system of  claim 21 , wherein the plurality of conductive members of the second packaged IC comprise at least one of a plurality of conductive balls and a plurality of conductive pads.  
     
     
         23 . The packaged IC system of  claim 21  further comprising a shielding support mounted on a top surface of the first packaged IC.  
     
     
         24 . The packaged IC system of  claim 23  further comprising at least one of a radio frequency shield or an electromagnetic interference shield mounted on the shielding support.