Inventor · disambiguated record
Ziep Tran
Also filed as: TRAN ZIEP
10 granted patents·2 pending applications·104 citations·filing 2005–2023
89Inventor score
Top patents by PatentIndex Score
12 records- 0197US10879025B2Electromechanical power switch integrated circuits and devices and methods thereofINOSO LLC·Filed 2020·Granted Dec 29, 2020·4 cites·20 claims
- 0296US8916872B1Method of forming a stacked low temperature diode and related devicesINOSO LLC·Filed 2014·Granted Dec 23, 2014·32 cites·27 claims
- 0396US8786130B1Method of forming an electromechanical power switch for controlling power to integrated circuit devices and related devicesINOSO LLC·Filed 2013·Granted Jul 22, 2014·25 cites·20 claims
- 0494US9087689B1Method of forming a stacked low temperature transistor and related devicesINOSO LLC·Filed 2014·Granted Jul 21, 2015·18 cites·24 claims
- 0591US9793080B2Electromechanical power switch integrated circuits and devices and methods thereofINOSO LLC·Filed 2016·Granted Oct 17, 2017·4 cites·30 claims
- 0689US8044494B2Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2009·Granted Oct 25, 2011·19 cites·17 claims
- 0783US12278070B2Electromechanical power switch integrated circuits and devices and methods thereofINOSO LLC·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 0876US9202756B1Method of forming a stacked low temperature transistor and related devicesINOSO LLC·Filed 2015·Granted Dec 1, 2015·2 cites·20 claims
- 0974US11562871B2Electromechanical power switch integrated circuits and devices and methods thereofINOSO LLC·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1062US10600600B2Electromechanical power switch integrated circuits and devices and methods thereofINOSO LLC·Filed 2017·Granted Mar 24, 2020·0 cites·20 claims
- 1148US2008108179A1Stackable molded packages and methods of making the sameFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 1243US2007141751A1Stackable molded packages and methods of making the sameMISTRY ADDI B·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →