Stackable molded packages and methods of making the same

Abstract

A first packaged integrated circuit (IC) includes a package substrate, at least one IC die attached to a first surface of the package substrate, a plurality of conductive members on the first surface at least partially surrounding the at least one IC die and electrically connected to the at least one IC die, an encapsulant over the first surface surrounding the at least one IC die and the plurality of conductive members, wherein at least a portion of each of the plurality of conductive members is exposed by the encapsulant. A second packaged IC may be stacked onto the first packaged IC. The second packaged IC includes at least one IC die and a plurality of conductive members, each conductive member of the plurality of conductive members of the second packaged IC is in contact with a corresponding conductive member of the plurality conductive members of the first packaged IC.

1 . A method for forming a packaged integrated circuit (IC) comprising: 
 providing a package substrate having a first surface, a first IC die attached to the first surface, a plurality of conductive members on the first surface at least partially surrounding the first IC die and electrically connected to the first IC die, and a dam on the first surface at least partially surrounding the plurality of conductive members; and    performing a surface fill by providing an encapsulant to the first surface of the package substrate wherein the encapsulant surrounds the first IC die and is at least partially contained by the dam and wherein performing the surface fill further includes providing a protection element in physical contact with a top portion of each of the plurality of conductive members and removing the protection element, such that the top portion of each of the plurality of conductive members remains exposed after the protection element is removed.    
     
     
         2 . The method of  claim 1 , wherein the package substrate has a second surface, opposite the first surface, the second surface having a plurality of external conductive members.  
     
     
         3 . The method of  claim 1 , wherein the package substrate has a second IC die over the first surface.  
     
     
         4 . The method of  claim 3 , wherein the second IC die is over the first IC die.  
     
     
         5 . The method of  claim 1 , wherein the first IC die is attached to the first surface with a plurality of wirebonds.  
     
     
         6 . The method of  claim 1 , wherein the first IC die is attached to the first surface with a plurality of conductive bumps.  
     
     
         7 . The method of  claim 6 , wherein providing the encapsulant to the first surface comprises providing the encapsulant as an underfill between the first IC die and the first surface.  
     
     
         8 . The method of  claim 1 , wherein the dam completely surrounds the plurality of conductive members together with the first IC die.  
     
     
         9 . The method of  claim 1 , wherein the package substrate further comprises a shielding support on the first surface for mounting a shield.  
     
     
         10 . The method of  claim 9 , wherein the shielding support is at least one of a radio frequency shield or an electromagnetic interference shield.  
     
     
         11 .- 24 . (canceled)  
     
     
         25 . The method of  claim 1 , wherein the protection element is a protection plate that includes a plurality of indentations for receiving each of the top portion of the plurality of conductive members.  
     
     
         26 . The method of  claim 25 , wherein providing the protection element further comprises: 
 providing a mold chase having the protection plate therein over the package substrate, the protection plate moveable inside the mold chase; and    applying a force to bring the protection plate into physical contact with the top portion of each of the plurality of conductive members.    
     
     
         27 . The method of  claim 26 , wherein the mold chase comprises a spring between the mold chase and the protection plate to apply the force.  
     
     
         28 . The method of  claim 1 , wherein providing the protection element further comprises providing a plurality of pad protectors into physical contact with the plurality of conductive pads, wherein each pad protector of the plurality of pad protectors is in physical contact with a corresponding conductive pad of the plurality of conductive pads.  
     
     
         29 . The method of  claim 28 , wherein providing the plurality of pad protectors comprises applying a vacuum through each of the plurality of pad protectors.  
     
     
         30 . The method of  claim 28 , wherein providing the plurality of pad protectors comprises applying a force to maintain the plurality of pad protectors in physical contact with the plurality of conductive pads, and wherein during providing the encapsulant, applying at least one of a positive pressure and a negative pressure through each of the plurality of pad protectors.  
     
     
         31 . A method for forming a packaged integrated circuit (IC) comprising: 
 providing a package substrate having a first surface, a first IC die attached to the first surface, a plurality of conductive members on the first surface at least partially surrounding the first IC die and electrically connected to the first IC die, and a dam on the first surface at least partially surrounding the plurality of conductive members; and    performing a surface fill by providing an encapsulant to the first surface of the package substrate wherein the encapsulant surrounds the first IC die and is at least partially contained by the dam and wherein performing the surface fill further includes providing a protection element in physical contact with a top portion of each of the plurality of conductive members, and removing the protection element, such that the top portion of each of the plurality of conductive members remains exposed after the protection element is removed, wherein the protection element is selected from a group consisting of a protection plate and a plurality of pad protectors.    
     
     
         32 . The method of  claim 31 , wherein the package substrate has a second surface, opposite the first surface, the second surface having a plurality of external conductive members.  
     
     
         33 . The method of  claim 31 , wherein the package substrate has a second IC die over the first surface.  
     
     
         34 . The method of  claim 33 , wherein the second IC die is over the first IC die.  
     
     
         35 . The method of  claim 31 , wherein the first IC die is attached to the first surface with a plurality of wirebonds.  
     
     
         36 . The method of  claim 31 , wherein the first IC die is attached to the first surface with a plurality of conductive bumps.  
     
     
         37 . The method of  claim 36 , wherein providing the encapsulant to the first surface comprises providing the encapsulant as an underfill between the first IC die and the first surface.  
     
     
         38 . The method of  claim 31 , wherein the dam completely surrounds the plurality of conductive members together with the first IC die.  
     
     
         39 . The method of  claim 31 , wherein the package substrate further comprises a shielding support on the first surface for mounting a shield.  
     
     
         40 . The method of  claim 39 , wherein the shielding support is at least one of a radio frequency shield or an electromagnetic interference shield.