Micro-fabricated device with thermoelectric device and method of making

Abstract

A micro-fabricated device, includes a support structure having an aperture formed therein, and a device substrate disposed within the aperture. The micro-fabricated device further includes a thermally isolating structure thermally coupling the device substrate to the support structure. The thermally isolating structure includes at least one n-doped region and at least one p-doped region formed on or in the thermally isolating structure and separated from each other. In addition, the thermally isolating structure includes an electrical interconnect connecting at least one n-doped region and at least one p-doped region, forming an integrated thermoelectric device.

1 . A micro-fabricated device, comprising 
 a support structure including an aperture formed therein;    a device substrate disposed at least partially within said aperture; and    a thermally isolating structure coupling said device substrate to said support structure; and    at least one thermoelectric segment integrated on or at a first major surface of said thermally isolating structure.    
   
   
       2 . The micro-fabricated device in accordance with  claim 1 , wherein said device substrate further comprises a peripheral edge, wherein said support structure further comprises an inner edge, wherein said peripheral edge is disposed a distance G from said inner edge, said distance G being measured proximate to said thermally isolating structure, and wherein said thermally isolating structure further comprises a thermally isolating structure length that is the thermal conduction path length thermal energy travels between said device substrate and said support structure, wherein said thermally isolating structure length is greater than said distance G.  
   
   
       3 . The micro-fabricated device in accordance with  claim 1 , wherein said at least one thermoelectric segment further comprises a plurality of thermoelectric segments, wherein said device substrate further comprises a peripheral edge, wherein said support structure further comprises an inner edge, wherein the number of thermoelectric segments increases in the direction from said peripheral edge to said inner edge.  
   
   
       4 . The micro-fabricated device in accordance with  claim 1 , wherein said thermally isolating structure further comprises a folded structure having at least one fold.  
   
   
       5 . The micro-fabricated device in accordance with  claim 1 , wherein said thermally isolating structure further comprises a thickness less than the thickness of said device structure.  
   
   
       6 . The micro-fabricated device in accordance with  claim 1 , wherein said thermally isolating structure further comprises a cross-sectional area that varies.  
   
   
       7 . The micro-fabricated device in accordance with  claim 1 , wherein said thermally isolating structure further comprises a structure projecting in a radial direction from a peripheral edge of said device substrate.  
   
   
       8 . The micro-fabricated device in accordance with  claim 1 , further comprising at least one active device disposed on said device substrate.  
   
   
       9 . The micro-fabricated device in accordance with  claim 8 , wherein said at least one active device further comprises at least one transistor.  
   
   
       10 . The micro-fabricated device in accordance with  claim 1 , further comprising a vacuum device disposed on said device substrate.  
   
   
       11 . The micro-fabricated device in accordance with  claim 10 , wherein said vacuum device further comprises an electron emitter.  
   
   
       12 . A storage device, comprising: 
 at least one micro-fabricated device of  claim 11;  and    a storage medium in close proximity to said at least one electronic device, said storage medium having a storage area in one of a plurality of states to represent information stored in that storage area.    
   
   
       13 . A computer system, comprising: 
 a microprocessor;    an electronic device including at least one micro-fabricated device of  claim 1  coupled to said microprocessor; and    memory coupled to said microprocessor, said microprocessor operable of executing instructions from said memory to transfer data between said memory and the electronic device.    
   
   
       14 . The computer system in accordance with  claim 13 , wherein said electronic device is a storage device.  
   
   
       15 . The computer system in accordance with  claim 13 , wherein said electronic device is a display device.  
   
   
       16 . The computer system in accordance with  claim 13 , wherein said microprocessor further comprises a micro-fabricated device having: 
 a support structure including an aperture formed therein;    a device substrate disposed within said aperture; and    a thermally isolating structure thermally coupling said device substrate to said support structure, said thermally isolating structure comprising: 
 at least one n-doped region disposed on or in said thermally isolating structure,  
 at least one p-doped region disposed on or in said thermally isolating structure, and  
 an electrical interconnect connecting said at least one n-doped region and said at least one p-doped region, whereby an integrated thermoelectric device is formed.  
   
   
   
       17 . The micro-fabricated device in accordance with  claim 1 , wherein said thermally isolating structure further comprises a second major surface, wherein at least one thermoelectric segment is disposed on or in said thermally isolating structure at each of said first and second major surfaces.  
   
   
       18 . The micro-fabricated device in accordance with  claim 1 , wherein said at least one thermoelectric segment further comprises at least one n-doped or p-doped region that includes a high Seebeck coefficient material.  
   
   
       19 . A micro-fabricated device, comprising: 
 a device substrate disposed at least partially within an aperture formed in a support structure;    means for hindering thermal conduction disposed between said device substrate and said support structure; and    means for thermoelectrically heating and/or cooling integrally disposed on or at a surface of said means for hindering thermal conduction.    
   
   
       20 . A micro-fabricated device, comprising 
 a support structure including an aperture formed therein;    a device substrate disposed at least partially within said aperture;    a thermally isolating structure integrally coupling said device substrate to said support structure; and    a thermoelectric device integrally disposed on or at a first major surface of said thermally isolating structure.    
   
   
       21 . A micro-fabricated device, comprising 
 a support structure including an aperture formed therein;    a device substrate disposed at least partially within said aperture; and    a thermally isolating structure coupling said device substrate to said support structure, said thermally isolating structure having: 
 at least one n-doped region disposed on or in said thermally isolating structure,  
 at least one p-doped region disposed on or in said thermally isolating structure, and  
   an electrical interconnect connecting said at least one n-doped region and said at least one p-doped region, forming at least one thermoelectric segment integrated with said thermally isolating structure.