Package warpage control

Abstract

A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

1 . An apparatus, comprising: 
 a restrainer lid to contact a substrate;    a carrier; and    a clip to attach the restrainer lid to the carrier during processing.    
     
     
         2 . The apparatus of  claim 1 , the apparatus further comprising a component die on the substrate and under the restrainer lid.  
     
     
         3 . The apparatus of  claim 1 , the restrainer lid further comprising a cavity with a depth sufficient to prevent contact between the restrainer lid and the component die.  
     
     
         4 . The apparatus of  claim 1 , the clip further comprising a t-clip.  
     
     
         5 . The apparatus of  claim 1 , the clip further comprising a spring mounted to contact the restrainer lid when the clip attaches the restrainer lid to the carrier.  
     
     
         6 . A system, comprising: 
 a substrate;    a component die to reside on the package substrate;    a carrier to receive the substrate for processing;    a restrainer lid to cover the component die and to contact the substrate; and    a clip to attach the restrainer lid to the carrier during processing.    
     
     
         7 . The system of  claim 6 , the component die further comprising a die for a semiconductor device.  
     
     
         8 . The system of  claim 6 , the carrier further comprising a chip carrier.  
     
     
         9 . The system of  claim 6 , the clip further comprising a t-clip.  
     
     
         10 . The system of  claim 6 , the clip further having a spring to contact the restrainer lid.  
     
     
         11 . A system, comprising: 
 a substrate having a cavity;    a component die residing in the cavity; and    a lid covering the cavity and the substrate resulting in a planar package.    
     
     
         12 . The system of  claim 11 , the system comprising connectors on an underside of the substrate.  
     
     
         13 . The system of  claim 11 , the system comprising capacitors on an underside of the substrate.  
     
     
         14 . The system of  claim 11 , the system comprising a sealant between the lid and the substrate.  
     
     
         15 . The system of  claim 11 , the system comprising a thermal interface material between the lid and the die.  
     
     
         16 . The system of  claim 11 , the component die residing in the cavity such that a top surface of the component die is planar with a top surface of the substrate.