Overmolded optical package

Abstract

An optical semiconductor package includes a substrate, a chip, a plurality of bonding wires, a window, a supporter, and an encapsulant. The chip is disposed on the substrate and has an optical element. The bonding wires are used for electrically connecting the chip to the substrate. The window is supported on the supporter and positioned over the optical element of the chip. The encapsulant is overmolded on the substrate for fixing the window and encapsulating the chip and the bonding wires.

1 . A method for manufacturing an optical semiconductor package, comprising the following steps of: 
 providing a substrate;    mounting a chip having an optical element on the substrate;    bonding a plurality of bonding wires to the chip and the substrate for electrically connecting the chip to the substrate;    providing a supporter;    disposing a window on the supporter;    mounting the supporter on the substrate;    positioning the window corresponding to the optical element of the chip; and    forming an encapsulant on the substrate for fixing the window and encapsulating the chip and the bonding wires.    
   
   
       2 . The method as claimed in  claim 1 , wherein the encapsulant forming step further comprises the following step of: 
 overmolding the encapsulant.    
   
   
       3 . The method as claimed in  claim 1 , further comprising the following step of: 
 joining the window and the supporter together.    
   
   
       4 . The method as claimed in  claim 1 , wherein the window is a lens.  
   
   
       5 . A method for manufacturing an optical semiconductor package, comprising the following steps of: 
 providing a substrate;    mounting a chip having an optical element on the substrate;    bonding a plurality of bonding wires to the chip and the substrate for electrically connecting the chip to the substrate;    mounting a window on the optical element of the chip; and    forming an encapsulant on the substrate for fixing the window and encapsulating the chip and the bonding wires.    
   
   
       6 . The method as claimed in  claim 5 , wherein the encapsulant forming step further comprises the following step of: 
 overmolding the encapsulant.    
   
   
       7 . The method as claimed in  claim 5 , wherein the window is a lens.  
   
   
       8 . The method as claimed in  claim 5 , wherein the window mounting step further comprises the following step of: 
 providing an adhesive for mounting the window on the optical element of the chip.