Method, System and Device for Microscopic Examination Employing Fib-Prepared Sample Grasping Element

Abstract

A method including, in one embodiment, severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB), capturing the substrate sample by activating a grasping element, and separating the captured sample from the substrate. The captured sample may be separated from the substrate and transported to an electron microscope for examination.

1 . A method, comprising: 
 severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB);    capturing the substrate sample by activating a grasping element; and    separating the captured sample from the substrate.    
   
   
       2 . The method of  claim 1  wherein at least a portion of the severing, capturing, and separating is performed via automation.  
   
   
       3 . The method of  claim 1  further comprising positioning the grasping element proximate the substrate sample via automation.  
   
   
       4 . The method of  claim 1  further comprising: 
 transporting the captured sample to an electron microscope for examination, wherein the transporting is performed via automation; and    examining the sample with the electron microscope.    
   
   
       5 . The method of  claim 1  wherein separating the sample at least partially from the substrate includes only partially separating the sample from the substrate, and wherein the method further includes completely severing the sample from the substrate after capturing the sample by the grasping element.  
   
   
       6 . The method of  claim 5  wherein completely severing the sample includes cutting a connection between the sample and the substrate.  
   
   
       7 . The method of  claim 6  wherein cutting the connection includes cutting with an FIB.  
   
   
       8 . The method of  claim 5  wherein completely separating the captured sample from the substrate includes repositioning the captured sample relative to the substrate until a connection between the sample and the substrate is compromised.  
   
   
       9 . The method of  claim 1  wherein activating the grasping element includes adjusting an amount of electrical power delivered to the grasping element.  
   
   
       10 . The method of  claim 1  wherein activating the grasping element includes switching between an electrically powered state and an electrically un-powered state.  
   
   
       11 . The method of  claim 1  wherein activating the grasping element includes increasing an amount of electrical power delivered to the grasping element.  
   
   
       12 . The method of  claim 1  wherein activating the grasping element includes substantially ceasing delivery of electrical power to the grasping element.  
   
   
       13 . The method of  claim 1  wherein the grasping element includes actuating means for mechanically opening and closing the grasping element.  
   
   
       14 . The method of  claim 13  wherein the actuating means includes electro-thermal actuating means.  
   
   
       15 . The method of  claim 13  wherein the actuating means includes electrostatic actuating means.  
   
   
       16 . The method of  claim 13  wherein the actuating means includes piezoelectric actuating means.  
   
   
       17 . The method of  claim 1  wherein the grasping element includes a thermally activated end-effector and activating the grasping element includes at least one of heating and cooling at least a portion of the grasping element.  
   
   
       18 . The method of  claim 1  further comprising examining the sample while the sample remains captured by the grasping element.  
   
   
       19 . The method of  claim 1  further comprising examining the sample after releasing the sample from the grasping element.  
   
   
       20 . The method of  claim 19  further comprising manipulating the grasping element to position the sample on an examination grid prior to the examination of the sample.  
   
   
       21 . The method of  claim 19  further comprising coupling the sample to an examination grid prior to the releasing the sample from the grasping element.  
   
   
       22 . The method of  claim 1  wherein the grasping element is a MEMS element.  
   
   
       23 . The method of  claim 22  wherein the MEMS element comprises nickel.  
   
   
       24 . The method of  claim 22  wherein the MEMS element comprises silicon.  
   
   
       25 . The method of  claim 1  wherein activating the grasping element includes pressing the grasping element against the substrate sample.  
   
   
       26 . The method of  claim 1  wherein the grasping element includes a malleable layer configured to interface with the substrate sample.  
   
   
       27 . The method of  claim 26  wherein the malleable layer comprises gold.  
   
   
       28 . The method of  claim 1  wherein: 
 severing includes severing each of a plurality of samples at least partially from a substrate;    capturing includes capturing each of the plurality of samples; and    separating includes separating each of the plurality of samples.    
   
   
       29 . The method of  claim 1  wherein at least one of the capturing and the separating is performed in a TEM.  
   
   
       30 . The method of  claim 1  wherein at least one of the capturing and the separating is performed in an SEM.  
   
   
       31 . A method, comprising: 
 severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB);    positioning an assembly tool proximate the sample, the assembly tool having a compression bond end-effector configured to capture the sample;    applying a force on the sample through the compression bond end-effector, the force having sufficient magnitude to cause a compression bond to form between the compression bond end-effector and the sample, thereby capturing the sample; and    separating the captured sample from the substrate.    
   
   
       32 . The method of  claim 31  further comprising: 
 transporting the captured sample to an electron microscope for examination; and    examining the sample with the electron microscope.    
   
   
       33 . The method of  claim 31  wherein applying a force on the sample includes actuating an actuator to which the compression bond end-effector is coupled.  
   
   
       34 . The method of  claim 33  wherein actuating includes electro-thermally activating.  
   
   
       35 . The method of  claim 33  wherein actuating includes electrostatically activating.  
   
   
       36 . A method, comprising: 
 severing a sample at least partially from a substrate by cutting the substrate with a focused ion beam (FIB);    capturing the substrate sample with a grasping element;    separating the captured sample from the substrate; and    releasing the captured substrate sample by activating the grasping element.    
   
   
       37 . The method of  claim 36  wherein capturing the substrate sample with the grasping element substantially includes passively capturing the substrate sample with the grasping element.  
   
   
       38 . The method of  claim 36  wherein the grasping element maintains a substantially constant temperature during capturing the substrate sample with the grasping element.  
   
   
       39 . The method of  claim 36  wherein the grasping element is configured to passively capture the substrate sample.  
   
   
       40 . The method of  claim 36  wherein the grasping element is configured to passively capture the substrate sample in the substantial absence of electrical power delivered to the grasping element.  
   
   
       41 . The method of  claim 36  wherein capturing the substrate sample with the grasping element includes capturing the substrate sample while the grasping element is in a non-activated state.  
   
   
       42 . The method of  claim 36  wherein substantially no electrical power is delivered to the grasping element while the grasping element is capturing the substrate sample.