Package warpage control

Abstract

A method of packaging includes placing a restrainer on a package during processing. The method includes clipping the restrainer in place and then exposing the package to high temperatures. After processing the restrainer is removed. An alternative process attaches a component die to a substrate having a cavity in a first surface. The process may then include dispensing and curing an underfill material in the cavity, and attaching a lid to the first surface of the substrate.

1 . A method of packaging, comprising: 
 attaching a component die to a substrate having a cavity in a first surface; and    attaching a lid to the first surface of the substrate.    
     
     
         2 . The method of  claim 1 , the method comprising dispensing and curing an underfill material in the cavity.  
     
     
         3 . The method of  claim 1 , the method comprising dispensing a thermal interface material on the component die.  
     
     
         4 . The method of  claim 1 , the method comprising dispensing a sealant on the package substrate prior to attaching the lid.  
     
     
         5 . The method of  claim 1 , the method comprising attaching capacitors to a second surface of the substrate.  
     
     
         6 . The method of  claim 1 , the method comprising attaching connectors to a second surface of the substrate.  
     
     
         7 . The method of  claim 1 , attaching the component die further comprising attaching a semiconductor device.  
     
     
         8 . The method of  claim 1 , attaching the component die further comprising attaching the component die using die bumps.  
     
     
         9 . The method of  claim 1 , attaching a lid further comprising sealing a mechanical stiffener to the substrate.  
     
     
         10 . The method of  claim 2 , dispensing and curing the underfill material further comprising dispensing and curing an underfill epoxy material.