Solder composition having dispersoid particles for increased creep resistance

Abstract

A solder composition is provided. A solder composition has a solder matrix material and dispersoid particles in the solder matrix material. The solder matrix material has a relatively low melting temperature and the dispersoid particles have a relatively high melting temperature.

1 . A solder composition comprising: 
 a solder matrix material having a relatively low melting temperature; and    dispersoid particles in the solder matrix material having a relatively high melting temperature.    
   
   
       2 . The solder composition of  claim 1 , wherein the solder matrix material is a eutectic of first and second different components.  
   
   
       3 . The solder composition of  claim 1 , wherein the solder matrix material includes first and second different components, each component including at least one of In, Sn, Bi, and Zn.  
   
   
       4 . The solder composition of  claim 1 , wherein the solder matrix material is one of In-48Sn, Bi-33In, Bi-33In-0.3Zn, In-46Sn-1.5Zn, In-47Bi-0.4Zn, Bi-25In-19Sn, In-34Bi, In-33Bi-0.5Zn, In-32Bi-20Sn, and In-35Bi-16Sn-0.4Zn.  
   
   
       5 . The solder composition of  claim 1 , wherein the melting temperature of the solder matrix material is below 150° C.  
   
   
       6 . The solder composition of  claim 5 , wherein the melting temperature of solder matrix material is below 125° C.  
   
   
       7 . The solder composition of  claim 1 , wherein the melting temperature of the dispersoid particles is above 1000° C.  
   
   
       8 . The solder composition of  claim 1 , wherein the dispersoid particles are between 10 and 200 nm across.  
   
   
       9 . The solder composition of  claim 1 , wherein the dispersoid particles make up between 1% and 20% of the composition by volume.  
   
   
       10 . The solder composition of  claim 1 , wherein the dispersoid particles are made of at least one of SiC, W 2 C, WC, ZrC, TiC, B 4 C, Cr 3 , C 2 , Cr 7 C 3 , Cr 3 C 6 , and Al 2 O 3 .  
   
   
       11 . The solder composition of  claim 1 , further comprising precipitation forming alloying elements.  
   
   
       12 . The solder composition of  claim 11 , wherein the precipitation forming alloying elements include at least one of Cu, Ni, Ag, Ti, Mn, Co, Au, and Fe.  
   
   
       13 . The solder composition of  claim 11 , wherein the precipitation forming alloying elements comprise between 1 and 10% of the composition by weight.  
   
   
       14 . An electronic assembly comprising: 
 a first piece including a microelectronic circuit;    a second piece; and    a solder composition attaching the first and second pieces to one another, including a solder matrix material having a relatively low melting temperature, and dispersoid particles in the solder matrix material having a relatively high melting temperature.    
   
   
       15 . The electronic assembly of  claim 14 , wherein the melting temperature of the solder matrix material is below 150° C. and the melting temperature of the dispersoid particles is above 1000° C.  
   
   
       16 . The electronic assembly of  claim 14 , wherein the solder matrix material includes first and second different components, each component including at least one of In, Sn, Bi, and Zn.  
   
   
       17 . The electronic assembly of  claim 14 , wherein the dispersoid particles include at least one of the SiC, W 2 C, WC, ZrC, TiC, B 4 C, Cr 3 , C 2 , Cr 7 C 3 , Cr 3 C 6 , and Al 2 O 3 .  
   
   
       18 . A method of making a solder composition, comprising: 
 mixing a solder matrix material with dispersoid particles of the solder matrix material having a relatively low melting temperature and the dispersoid particles having a relatively high melting temperature.    
   
   
       19 . The method of  claim 18 , wherein the solder matrix material include particles, the method further comprising heating the particles so that they melt and reflow so that they attach to one another, and cooling the material of the particles attaching first and second pieces to one another.  
   
   
       20 . The method of  claim 18 , further comprising manufacturing a master ingot that includes the solder matrix material and the dispersoid particles, and breaking the master ingot into solder particles.