Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Abstract

A method of producing a semiconductor package enabling a sheet-like adhesive film to be used as it is and thereby reducing loss and enabling mounting without the piece of adhesive film sticking out from the semiconductor chip, comprising forming cutting-off notches in an adhesive film provided on a support film from the adhesive film side down to the surface of the support film or a depth D in the middle and cutting the adhesive film to pieces of predetermined size, then stretching the support film to separate the cut individual piece of the adhesive film, attaching semiconductor chip to the cut individual piece of the adhesive film, and mounting the semiconductor chip on a substrate by the piece of adhesive film, and an apparatus for producing a semiconductor package and adhesive film for use with that method.

1 - 7 . (canceled)  
     
     
         8 . An apparatus for producing a semiconductor package mounting a semiconductor chip on a substrate by an adhesive film, comprising: 
 a support which supports a support film on which an adhesive film having cutting-off notches into a plurality of pieces having a predetermined size is provided;    a pushup tool having a rounded tip which pushes up said support film from the back side of the surface on which said adhesive film is provided so as to stretch said support film and separate said adhesive film into the cut individual pieces;    a suction unit which picks up said semiconductor chip by suction and attaches said semiconductor chip to the individual cut piece of adhesive film and which picks up by suction said semiconductor chip on which said piece of adhesive film is attached and mounts the semiconductor chip on said substrate.    
     
     
         9 . (canceled)