Inventor · disambiguated record
Osamu Yamagata
Also filed as: YAMAGATA OSAMU
23 granted patents·3 pending applications·373 citations·filing 1995–2020
96Inventor score
Top patents by PatentIndex Score
26 records- 0196US7727803B2Semiconductor device, package structure thereof, and method for manufacturing the semiconductor deviceSONY CORP·Filed 2007·Granted Jun 1, 2010·41 cites·15 claims
- 0296US7429793B2Semiconductor device having an electronic circuit disposed thereinSONY CORP·Filed 2006·Granted Sep 30, 2008·40 cites·5 claims
- 0392US7462511B2Semiconductor device and the method of producing the sameSONY CORP·Filed 2006·Granted Dec 9, 2008·23 cites·14 claims
- 0491US6858892B2Semiconductor deviceSONY CORP·Filed 2003·Granted Feb 22, 2005·60 cites·13 claims
- 0588US7220667B2Semiconductor device and method of fabricating the sameSONY CORP·Filed 2004·Granted May 22, 2007·46 cites·21 claims
- 0687US7208832B2Semiconductor device, package structure thereof, and method for manufacturing the semiconductor deviceSONY CORP·Filed 2004·Granted Apr 24, 2007·42 cites·11 claims
- 0785US7510910B2Semiconductor device and production method thereofSONY CORP·Filed 2006·Granted Mar 31, 2009·10 cites·5 claims
- 0882US8872350B2Semiconductor device and manufacturing method thereofSAWACHI SHIGENORI·Filed 2012·Granted Oct 28, 2014·11 cites·12 claims
- 0982US7981722B2Semiconductor device and fabrication method thereofSONY CORP·Filed 2008·Granted Jul 19, 2011·8 cites·14 claims
- 1077US5552637ASemiconductor deviceTOSHIBA KK·Filed 1995·Granted Sep 3, 1996·54 cites·3 claims
- 1169USRE49631ESemiconductor device and production method thereofSONY CORP·Filed 2020·Granted Aug 29, 2023·0 cites·39 claims
- 1269US7157796B2Semiconductor device and the method of producing the sameSONY CORP·Filed 2004·Granted Jan 2, 2007·13 cites·7 claims
- 1365US7170175B2Semiconductor device and production method thereofSONY CORP·Filed 2004·Granted Jan 30, 2007·9 cites·3 claims
- 1459US8263871B2Mount board and semiconductor moduleASAMI HIROSHI·Filed 2009·Granted Sep 11, 2012·1 cites·7 claims
- 1559US7214567B2Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive filmSONY CORP·Filed 2004·Granted May 8, 2007·7 cites·7 claims
- 1652US8786110B2Semiconductor device and manufacturing method thereofMARUTANI HISAKAZU·Filed 2011·Granted Jul 22, 2014·2 cites·8 claims
- 1751US9147671B2Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing sameINOUE HIROSHI·Filed 2014·Granted Sep 29, 2015·0 cites·9 claims
- 1850US7892887B2Semiconductor device and fabrication method thereofSONY CORP·Filed 2010·Granted Feb 22, 2011·0 cites·14 claims
- 1949US6960494B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2004·Granted Nov 1, 2005·4 cites·5 claims
- 2048US2007246165A1Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive filmSONY CORP·Filed 2006·Application pending·0 cites
- 2145US9196507B1Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing sameINOUE HIROSHI·Filed 2015·Granted Nov 24, 2015·0 cites·1 claims
- 2245US7902672B2Semiconductor device and method of manufacturing sameSONY CORP·Filed 2007·Granted Mar 8, 2011·0 cites·4 claims
- 2343US6836012B2Semiconductor package and method of manufacturing the sameTOSHIBA KK·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
- 2438US8901754B2Semiconductor device and manufacturing method thereofYAMAGATA OSAMU·Filed 2011·Granted Dec 2, 2014·0 cites·6 claims
- 2533US2010213599A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2010·Application pending·0 cites
- 2632US2013026650A1Semiconductor device, semiconductor module structure configured by vertically stacking semiconductor devices, and manufacturing method thereofYAMAGATA OSAMU·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →