Method for fabricating a module having an electrical contact-connection

Abstract

A method for fabricating a module having an electrical contact-connection is disclosed. One embodiment provides a chip having a contact area, applying a contact elevation to the contact area and applying a solder material to the contact elevation. The contact elevation may be applied to the contact area by using a bonding process in order to implement the contact elevation in the form of a stud bump.

1 . A method for fabricating an electronic module comprising: 
 providing a chip having a contact area;    applying a contact elevation to the contact area, wherein the contact elevation is applied using a bonding process, configured to implement the contact elevation as a stud bump; and    applying a solder material to the contact elevation, to form an electrical contact-connection.    
     
     
         2 . The method of  claim 1 , coupling the chip to a carrier substrate.  
     
     
         3 . The method of  claim 1 , comprising applying the solder material to the contact elevation by immersing the contact elevation in a bath comprising liquid solder material.  
     
     
         4 . The method of  claim 1 , comprising applying the solder material to the contact elevation by using a stencil printing method.  
     
     
         5 . The method of  claim 4 , comprising placing a stencil having a passage hole onto the chip at the position of the contact elevation and introducing a solder paste into the passage hole with the solder material causing the solder paste to come into contact with the contact elevation.  
     
     
         6 . The method of  claim 5 , comprising carrying out a heat treatment process out after introducing the solder paste into the passage hole in order to melt the solder paste, causing the solder material to combine with the material of the contact elevation, and subsequently the stencil is removed.  
     
     
         7 . The method of  claim 5 , comprising removing the stencil after introducing the solder paste into the passage hole, and carrying out a heat treatment process out in order to melt the solder paste, thereby causing the solder material to combine with the material of the contact elevation.  
     
     
         8 . A method for fabricating a chip having an electrical contact-connection, comprising: 
 providing a chip having a contact area;    applying a contact elevation to the contact area, wherein the contact elevation is applied by using a bonding process in order to implement the contact elevation in the form of a stud bump; and    applying a solder material to the contact elevation.    
     
     
         9 . The method of  claim 8 , comprising using gold as material for the contact elevation.  
     
     
         10 . The method of  claim 8 , comprising applying the solder material to the contact elevation by immersing the contact elevation in a bath comprising liquid solder material.  
     
     
         11 . The method of  claim 8 , comprising applying the solder material to the contact elevation by using a stencil printing method.  
     
     
         12 . The method of  claim 11 , comprising placing a stencil having a passage hole onto the chip at the position of the contact elevation and introducing a solder paste into the passage hole with the solder material causing the solder paste to come into contact with the contact elevation.  
     
     
         13 . The method of  claim 12 , comprising carrying out a heat treatment process out after introducing the solder paste into the passage hole in order to melt the solder paste, thereby causing the solder material to combine with the material of the contact elevation, and subsequently the stencil is removed.  
     
     
         14 . The method of  claim 12 , comprising removing wherein the stencil after introducing the solder paste into the passage hole, and carrying out a heat treatment process out in order to melt the solder paste, thereby causing the solder material to combine with the material of the contact elevation.  
     
     
         15 . The method of  claim 12 , wherein the solder paste comprises a self-curing material.  
     
     
         16 . The method of  claim 8 , comprising providing wherein a flat stencil having a depression into which a solder paste is introduced with the solder material, and wherein the chip is placed onto the flat stencil in such a manner that the contact elevation projects into the depression and the solder paste comes into contact with the contact elevation.  
     
     
         17 . The method of  claim 16 , comprising carrying out wherein a heat treatment process out in order to melt the solder paste, thereby causing the solder material to combine with the material of the contact elevation, and subsequently removing the flat stencil.  
     
     
         18 . The method of  16 , comprising lifting the contact elevation out of the depression with the solder paste adhering to the contact elevation, and subsequently carrying out a heat treatment process in order to melt the solder paste, thereby causing the solder material to combine with the material of the contact elevation.  
     
     
         19 . The method of  claim 16 , wherein the solder paste comprises a self-curing material.  
     
     
         20 . A method for fabricating an electronic module, comprising: 
 providing a carrier substrate having a contact region;    providing a chip having a contact area;    applying a contact elevation to the contact area of the chip, wherein the contact elevation is applied by using a bonding process in order to implement the contact elevation in the form of a stud bump;    applying a solder material to the contact elevation of the chip;    placing the chip with the contact elevation onto the contact region of the carrier substrate; and    fusing the solder material of the contact elevation in a heat treatment process, thereby causing the contact elevation to combine with the contact region via the solder material.    
     
     
         21 . A chip comprising: 
 an electrical contact-connection, wherein the electrical contact-connection comprises a contact elevation which is applied to a contact area by using a bonding process and which is implemented in the form of a stud bump, and wherein a solder material is applied to the contact elevation.    
     
     
         22 . The chip of  claim 21 , wherein a material of the contact elevation comprises gold.  
     
     
         23 . An electronic module comprising: 
 a chip having an electrical contact-connection, wherein the electrical contact-connection comprises a contact elevation which is applied to a contact area by using a bonding process and which is implemented in the form of a stud bump, and wherein a solder material is applied to the contact elevation; and    a carrier substrate coupled to the chip at the electrical contact-connection.