Inventor · disambiguated record
Roland Irsigler
Also filed as: IRSIGLER ROLAND
28 granted patents·15 pending applications·540 citations·filing 2002–2011
96Inventor score
Top patents by PatentIndex Score
43 records- 0196US7960843B2Chip arrangement and method of manufacturing a chip arrangementQIMONDA AG·Filed 2009·Granted Jun 14, 2011·54 cites·13 claims
- 0295US7829380B2Solder pillar bumping and a method of making the sameQIMONDA AG·Filed 2006·Granted Nov 9, 2010·36 cites·70 claims
- 0395US7638869B2Semiconductor deviceQIMONDA AG·Filed 2007·Granted Dec 29, 2009·76 cites·10 claims
- 0495US6845554B2Method for connection of circuit unitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 25, 2005·114 cites·7 claims
- 0594US8048479B2Method for placing material onto a target board by means of a transfer boardQIMONDA AG·Filed 2006·Granted Nov 1, 2011·34 cites·21 claims
- 0694US6714418B2Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 30, 2004·89 cites·26 claims
- 0783US7834462B2Electric device, stack of electric devices, and method of manufacturing a stack of electric devicesQIMONDA AG·Filed 2007·Granted Nov 16, 2010·17 cites·24 claims
- 0882US7247948B2Semiconductor device and method for fabricating the semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jul 24, 2007·31 cites·6 claims
- 0973US7080988B2Flexible contact-connection deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 25, 2006·5 cites·10 claims
- 1072US6919232B2Process for producing a semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jul 19, 2005·18 cites·19 claims
- 1169US6979591B2Connection of integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Dec 27, 2005·16 cites·9 claims
- 1268US7265451B2Semiconductor and method for producing a semiconductorINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 4, 2007·4 cites·45 claims
- 1366US8049310B2Semiconductor device with an interconnect element and method for manufactureQIMONDA AG·Filed 2008·Granted Nov 1, 2011·3 cites·7 claims
- 1463US7847415B2Method for manufacturing a multichip module assemblyQIMONDA AG·Filed 2008·Granted Dec 7, 2010·2 cites·25 claims
- 1562US6897088B2Method for connecting circuit devicesINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 24, 2005·10 cites·6 claims
- 1662US6630723B2Laser programming of integrated circuitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Oct 7, 2003·10 cites·6 claims
- 1761US8124521B2Electrical through contactHEDLER HARRY·Filed 2007·Granted Feb 28, 2012·2 cites·41 claims
- 1861US7074649B2Method for producing an integrated circuit with a rewiring device and corresponding integrated circuitINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jul 11, 2006·9 cites·19 claims
- 1955US7211472B2Method for producing a multichip module and multichip moduleINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 1, 2007·6 cites·9 claims
- 2053US7022549B2Method for connecting an integrated circuit to a substrate and corresponding arrangementINFINEON TECHNOLOGIES AG·Filed 2003·Granted Apr 4, 2006·4 cites·20 claims
- 2152US2009212420A1integrated circuit device and method for fabricating sameHEDLER HARRY·Filed 2008·Application pending·0 cites
- 2247US2008150154A1Method for fabricating a circuitQIMONDA AG·Filed 2007·Application pending·0 cites
- 2347US2006244109A1Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regionsINFINEON TECHNOLOGIES AG A GER·Filed 2006·Application pending·0 cites
- 2446US2011217812A1Integrated circuit device and method for fabricating same with an interposer substrateHEDLER HARRY·Filed 2011·Application pending·0 cites
- 2545US8106511B2Reduced-stress through-chip feature and method of making the sameHEDLER HARRY·Filed 2008·Granted Jan 31, 2012·0 cites·24 claims
- 2645US7646090B2Semiconductor module for making electrical contact with a connection device via a rewiring deviceINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 12, 2010·0 cites·19 claims
- 2745US2010065949A1Stacked Semiconductor Chips with Through Substrate ViasTHIES ANDREAS·Filed 2008·Application pending·0 cites
- 2844US2008164611A1Method for making an integrated circuit having a via holeQIMONDA AG·Filed 2007·Application pending·0 cites
- 2944US2007273011A1Method for fabricating a module having an electrical contact-connectionQIMONDA AG·Filed 2007·Application pending·0 cites
- 3044US2006091561A1Electronic component comprising external surface contacts and a method for producing the sameDANGELMAIER JOCHEN·Filed 2003·Application pending·0 cites
- 3141US8598716B2Semiconductor apparatus having stacked semiconductor componentsHEDLER HARRY·Filed 2005·Granted Dec 3, 2013·0 cites·3 claims
- 3241US7087512B2Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regionsINFINEON TECHNOLOGIES AG·Filed 2003·Granted Aug 8, 2006·0 cites·10 claims
- 3341US2007023886A1Method for producing a chip arrangement, a chip arrangement and a multichip deviceHEDLER HARRY·Filed 2006·Application pending·0 cites
- 3440US8072084B2Integrated circuit, circuit system, and method of manufacturingIRSIGLER ROLAND·Filed 2007·Granted Dec 6, 2011·0 cites·25 claims
- 3540US2007032059A1Method of manufacturing a semiconductor structure having a wafer through-contact and a corresponding semiconductor structureHEDLER HARRY·Filed 2005·Application pending·0 cites
- 3640US2007084944A1Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stackingHEDLER HARRY·Filed 2005·Application pending·0 cites
- 3739US2005067689A1Semiconductor module and method for producing a semiconductor moduleFiled 2004·Application pending·0 cites
- 3838US7211451B2Process for producing a component moduleINFINEON TECHNOLOGIES AG·Filed 2002·Granted May 1, 2007·0 cites·9 claims
- 3938US2003143819A1Method of producing semiconductor chips with a chip edge guard, in particular for wafer level packaging chipsINFINEON TECHNOLOGIES AG·Filed 2003·Application pending·0 cites
- 4037US7338843B2Method for producing an electronic component, especially a memory chipINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 4, 2008·0 cites·25 claims
- 4137US6861291B2Method producing a contact connection between a semiconductor chip and a substrate and the contact connectionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 1, 2005·0 cites·8 claims
- 4236US2005014394A1Contact-connection device for electronic circuit units and production methodINFINEON TECHNOLOGIES·Filed 2004·Application pending·0 cites
- 4335US2007120268A1Intermediate connection for flip chip in packagesIRSIGLER ROLAND·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →