Backing plate assembly

Abstract

In certain embodiments, the invention comprises a backing plate for accommodating large area sputtering targets is disclosed. The backing plate assembly has cavities carved into the back surface of the backing plate. The backing plate may further include cooling channels that run through the backing plate to control the temperature of the backing plate and the target. The cavities may be filled with a material that has a lower density than the backing plate. Additionally, the entire back surface may be covered with the material to produce a smooth surface upon which a magnetron may move during a PVD process.

1 . A backing plate assembly, comprising:
 a backing plate comprising a front surface and a back surface having at least one cavity; and   a fill material formed over the back surface and within the at least one cavity, the fill material having a substantially smooth back surface.   
     
     
         2 . The assembly of  claim 1 , wherein the fill material is a polymer. 
     
     
         3 . The assembly of  claim 1 , wherein the backing plate comprises a material selected from the group consisting of aluminum, copper, stainless steel, titanium, and alloys thereof. 
     
     
         4 . The assembly of  claim 1 , further comprising:
 at least one cooling channel within the backing plate, wherein the at least one cooling channel is adjacent to the at least one cavity.   
     
     
         5 . The assembly of  claim 1 , wherein the fill material has a lower density than the backing plate. 
     
     
         6 . A backing plate assembly, comprising:
 a backing plate having a front surface and a back surface, the back surface comprising one or more cavity portions and one or more raised portions; and   a fill material formed over the one or more cavity portions and the one or more raised portions.   
     
     
         7 . The assembly of  claim 6 , wherein the fill material is a polymer. 
     
     
         8 . The assembly of  claim 6 , wherein the backing plate comprises a material selected from the group consisting of aluminum, copper, stainless steel, titanium, and alloys thereof. 
     
     
         9 . The assembly of  claim 6 , further comprising:
 at least one cooling channel within the backing plate.   
     
     
         10 . The assembly of  claim 6 , wherein the fill material has a lower density than the backing plate. 
     
     
         11 . An apparatus, comprising:
 a backing plate, the backing plate comprises:
 a front surface and a back surface; and 
 at least one cavity formed in the back surface; 
   a sputtering target coupled with the front surface of the backing plate;   a fill material within the at least one cavity and covering the back surface of the backing plate; and   a magnetron movable between a first position and a second position along the fill material.   
     
     
         12 . The apparatus of  claim 11 , wherein the fill material has a lower density than the backing plate. 
     
     
         13 . The apparatus of  claim 11 , further comprising:
 at least one cooling channel within the backing plate and adjacent the at least one cavity.   
     
     
         14 . The apparatus of  claim 13 , further comprising:
 a plurality of cavities and a plurality of cooling channels, wherein the cavities and cooling channels alternate along the back surface of the backing plate.   
     
     
         15 . The apparatus of  claim 11 , wherein the fill material that is within the at least one cavity and covering the back surface of the backing plate is a single, unitary piece of polymer. 
     
     
         16 . The apparatus of  claim 11 , further comprising:
 a plurality of backing plates, wherein each backing plate comprises:
 a front surface and a back surface; and 
 at least one cavity formed in the back surface; 
   a fill material within the at least one cavity and covering each backing plate.   
     
     
         17 . The apparatus of  claim 16 , further comprising:
 a plurality of magnetrons, wherein each backing plate has a corresponding magnetron.   
     
     
         18 . The apparatus of  claim 11 , further comprising:
 a plurality of sputtering targets.   
     
     
         19 . The apparatus of  claim 11 , wherein the magnetron is coupled with at least one roller ball for moving the magnetron. 
     
     
         20 . The apparatus of  claim 11 , wherein the magnetron is coupled with at least one low friction sliding contact pad for moving the magnetron. 
     
     
         21 . A sputtering target assembly, comprising:
 a backing plate, the backing plate comprising:
 a front surface and a back surface; 
 at least one cavity formed in the back surface of the backing plate; 
   a sputtering target coupled with the front surface of the backing plate; and   fill material within the at least one cavity and across the back surface of the backing plate, the fill material has a lower density than the backing plate.   
     
     
         22 . The assembly of  claim 21 , wherein the fill material comprises a polymer. 
     
     
         23 . The assembly of  claim 21 , further comprising:
 at least one cooling channel within the backing plate, wherein the at least one cooling channel is adjacent the at least one cavity.   
     
     
         24 . The assembly of  claim 23 , further comprising:
 a plurality of cavities and a plurality of cooling channels, wherein the cavities and cooling channels alternate along the back surface of the backing plate.   
     
     
         25 . The assembly of  claim 21 , wherein the backing plate comprises a material selected form the group consisting of aluminum, copper, stainless steel, titanium, and alloys thereof. 
     
     
         26 . A sputtering method, comprising:
 providing a backing plate having a front surface and a back surface with at least one cavity, the at least one cavity is filled with a material that has a lower density than the backing plate;   providing a target coupled to the front surface of the backing plate; and   applying a bias to the sputtering target assembly.   
     
     
         27 . The method of  claim 26 , further comprising:
 moving a magnetron across the back surface of the backing plate.   
     
     
         28 . The method of  claim 27 , wherein the magnetron is moved by rolling the magnetron on at least one roller ball that is coupled with the magnetron. 
     
     
         29 . The method of  claim 27 , wherein the magnetron is moved by moving at least one low friction sliding contact pad that is coupled with the magnetron.