Polishing method and polishing pad

Abstract

A polishing method includes polishing a surface to be polished of a target object by using a polishing pad in which a cutout part been formed by cutting out a polishing surface from an outer circumferential end toward an inner part, and after polishing, separating the target object from the polishing pad at a position in contact with the cutout part.

1 . A polishing method, comprising: 
 polishing a surface to be polished of a target object by using a polishing pad in which a cutout part been formed by cutting out a polishing surface from an outer circumferential end toward an inner part; and    after polishing, separating the target object from the polishing pad at a position in contact with the cutout part.    
     
     
         2 . The polishing method according to  claim 1 , wherein the surface to be polished of the target object is polished at a position not in contact with the cutout part.  
     
     
         3 . The polishing method according to  claim 1 , wherein the polishing pad in which a plurality of cutout parts been formed regularly along outer circumferential parts of the polishing surface of the polishing pad is used.  
     
     
         4 . The polishing method according to  claim 1 , wherein the target object is separated from the polishing pad without being moved up to a point outside the outer circumferential end of the polishing surface of the polishing pad.  
     
     
         5 . The polishing method according to  claim 1 , wherein the target object is separated from the rotating polishing pad.  
     
     
         6 . The polishing method according to  claim 1 , wherein the target object is separated while rotating.  
     
     
         7 . The polishing method according to  claim 6 , wherein the target object is separated from the polishing pad after stopping the rotating polishing pad.  
     
     
         8 . A polishing method, comprising: 
 polishing a surface to be polished of a target object by using a polishing pad in which a cutout part been formed by cutting out a polishing surface from an outer circumferential end toward an inner part;    after polishing, moving the target object to a position where a contact area between the target object and the polishing pad becomes smaller based on the cutout part formed in the polishing pad; and    after moving, separating the target object from the polishing pad.    
     
     
         9 . The polishing method according to  claim 8 , wherein the target object is separated from the polishing pad without being moved up to a point outside the outer circumferential end of the polishing surface of the polishing pad.  
     
     
         10 . The polishing method according to  claim 8 , wherein the surface to be polished of the target object is polished at a position not in contact with the cutout part.  
     
     
         11 . The polishing method according to  claim 8 , wherein the polishing pad in which a plurality of cutout parts been formed regularly along outer circumferential parts of the polishing surface of the polishing pad is used.  
     
     
         12 . A polishing pad, comprising: 
 a polishing surface for polishing a target object; and    an outer circumferential side surface in which a plurality of cutout parts been formed from an outer circumferential end of the polishing surface toward an inner part to be cut through from the polishing surface to a back surface of the polishing surface.    
     
     
         13 . The polishing pad according to  claim 12 , wherein the plurality of cutout parts are formed by a straight line from the outer circumferential end of the polishing surface toward the inner part.  
     
     
         14 . The polishing pad according to  claim 13 , wherein the plurality of cutout parts have a cutout bottom formed by a straight line.  
     
     
         15 . The polishing pad according to  claim 13 , wherein the plurality of cutout parts have a cutout bottom formed by a gentle curve.  
     
     
         16 . The polishing pad according to  claim 13 , wherein the plurality of cutout parts have a cutout bottom formed by a semicircle.  
     
     
         17 . The polishing pad according to  claim 12 , wherein the plurality of cutout parts are formed by a gentle curve from the outer circumferential end of the polishing surface toward the inner part.  
     
     
         18 . The polishing pad according to  claim 12 , wherein the plurality of cutout parts are formed by a semicircle formed from the outer circumferential end of the polishing surface toward the inner part.  
     
     
         19 . The polishing pad according to  claim 12 , wherein a corner between the polishing surface and the side surface of the plurality of cutout parts is formed as a curve.  
     
     
         20 . The polishing pad according to  claim 12 , wherein a corner between the polishing surface and the side surface of the plurality of cutout parts is chamfered by a plane.