Gas storage and dispensing system for variable conductance dispensing of gas at constant flow rate

Abstract

A gas supply system arranged for dispensing of gas at a predetermined flow rate. The system employs a gas dispensing flow circuitry arranged for dispensing gas at selectively variable gas flow conductance conditions, to maintain the flow rate of the dispensed gas at a predetermined, e.g., constant, value in the operation of the system. The gas dispensing flow circuitry may include an array of dispensed gas flow passages, each of a differing conductance, or alternatively a variable conductance gas flow passage equipped with a variable conductance assembly for modulating the gas flow conductance of the passage, in response to sensed pressure of the gas or other system parameter. The system permits the flow rate of a dispensed gas to be maintained at a consistent desired level, despite the progressive decline in source gas pressure as the gas source vessel is depleted in use.

1 . A fluid supply system arranged for dispensing fluid at predetermined flow rate, comprising a fluid storage and dispensing vessel, a valve head assembly coupled to said vessel and arranged to dispense fluid from the vessel under dispensing conditions, and a pressure-responsive flow control device interiorly disposed in the vessel and arranged to control dispensing of fluid from the vessel, wherein said pressure-responsive flow control device includes an elastomeric memory material that is responsive to fluid pressure in the vessel to vary fluid flow conductance in the dispensing of fluid from the vessel.  
   
   
       2 . The fluid supply system of  claim 1 , wherein the elastomeric memory material is exudable on a support element to an extent determined by said fluid pressure in the vessel, to vary said fluid flow conductance in the dispensing of fluid from the vessel.  
   
   
       3 . The fluid supply system of  claim 1 , wherein the exuded elastomeric memory material defines a variable size opening whose size is determined by the extent of exudation of the elastomeric memory material in response to the fluid pressure in the vessel.  
   
   
       4 . The fluid supply system of  claim 1 , wherein the pressure-responsive flow control device is coupled with a fluid pressure sensor interiorly disposed in the vessel.  
   
   
       5 . The fluid supply system of  claim 1 , wherein the pressure-responsive flow control device is arranged so that elastomeric memory material is responsive to fluid pressure in the vessel to vary fluid flow conductance and maintain a substantially constant fluid flow rate in the dispensing of fluid from the vessel.  
   
   
       6 . The fluid supply system of  claim 1 , wherein the pressure-responsive flow control device is arranged so that elastomeric memory material is responsive to fluid pressure in the vessel to vary fluid flow conductance from a lower initial value to a higher final value in the dispensing of fluid from the vessel.  
   
   
       7 . The fluid supply system of  claim 1 , wherein the vessel contains a semiconductor manufacturing fluid.  
   
   
       8 . The fluid supply system of  claim 7 , wherein the semiconductor manufacturing fluid is selected from the group consisting of hydride gases, halide gases and organometallic source reagent gases.  
   
   
       9 . A fluid supply system arranged for dispensing fluid at predetermined flow rate, comprising a fluid storage and dispensing vessel, a valve head assembly coupled to said vessel and arranged to dispense fluid from the vessel under dispensing conditions, and a pressure-responsive flow control device arranged to control dispensing of fluid from the vessel, wherein said pressure-responsive flow control device includes an inflatable bladder responsive to fluid pressure in the vessel to vary fluid flow conductance in the dispensing of fluid from the vessel.  
   
   
       10 . The fluid supply system of  claim 9 , wherein the pressure-responsive flow control device is interiorly disposed in the vessel.  
   
   
       11 . The fluid supply system of  claim 9 , wherein the bladder defines a flow opening whose size is determined by the extent of inflation of the bladder, and a source of inflation fluid in fluid flow communication with the bladder, wherein the source is arranged to inflate the bladder to vary fluid flow conductance in the dispensing of fluid from the vessel.  
   
   
       12 . The fluid supply system of  claim 9 , wherein the vessel contains a semiconductor manufacturing fluid.  
   
   
       13 . The fluid supply system of  claim 9 , wherein the semiconductor manufacturing fluid is selected from the group consisting of hydride gases, halide gases and organometallic source reagent gases.  
   
   
       14 . A fluid supply system, comprising a fluid storage and dispensing vessel, a valve head assembly coupled to said vessel and arranged to dispense fluid from the vessel under dispensing conditions, and a variable conductance flow control device arranged to control dispensing of fluid from the vessel, wherein said variable conductance flow control device is responsive to fluid pressure in the vessel to vary fluid flow conductance in the dispensing of fluid from the vessel to (i) maintain a substantially constant flow of fluid from the vessel during said dispensing, and (ii) increase fluid flow conductance in a final phase of fluid dispensing, to dispense at least 90% of fluid from the vessel in said dispensing.  
   
   
       15 . The fluid supply system of  claim 14 , wherein the variable conductance flow control device is responsive to increase fluid flow conductance in a final phase of fluid dispensing, to dispense at least 95% of fluid from the vessel in said dispensing.  
   
   
       16 . The fluid supply system of  claim 14 , wherein the variable conductance flow control device is responsive to increase fluid flow conductance in a final phase of fluid dispensing, to dispense at least 98% of fluid from the vessel in said dispensing.  
   
   
       17 . A fluid supply system, comprising a fluid storage and dispensing vessel, a valve head assembly coupled to said vessel and arranged to dispense fluid from the vessel under dispensing conditions, and a variable conductance flow control device arranged to control dispensing of fluid from the vessel, wherein said variable conductance flow control device is responsive to fluid pressure in the vessel to vary fluid flow conductance in the dispensing of fluid from the vessel to maintain a substantially constant flow of fluid from the vessel during said dispensing, and wherein the variable conductance flow control device is coupled to a mechanical linkage that in turn is coupled with a fluid pressure sensing device that is arranged to sense pressure of fluid in the vessel and responsively translate the mechanical linkage to modulate the variable conductance flow control device so that it maintains said substantially constant flow of fluid from the vessel during said dispensing.  
   
   
       18 . The fluid supply system of  claim 17 , wherein the fluid pressure sensing device comprises a fluid feed tube arranged to flow dispensed fluid to a pressure-deflectable biased element, wherein the pressure-deflectable biased element translates in response to pressure of the dispensed fluid to modulate the variable conductance flow control device.  
   
   
       19 . The fluid supply system of  claim 18 , wherein the pressure-deflectable biased element comprises a piston.  
   
   
       20 . The fluid supply system of  claim 17 , wherein the vessel contains a semiconductor manufacturing fluid.  
   
   
       21 . The fluid supply system of  claim 20 , wherein the semiconductor manufacturing fluid is selected from the group consisting of hydride gases, halide gases and organometallic source reagent gases.  
   
   
       22 . A semiconductor manufacturing apparatus, comprising: 
 a fluid supply system, including a fluid storage and dispensing vessel, a valve head assembly coupled to said vessel and arranged to dispense fluid from the vessel under dispensing conditions, and a variable conductance flow control device arranged to control dispensing of fluid from the vessel, wherein said variable conductance flow control device is responsive to fluid pressure in the vessel to vary fluid flow conductance in the dispensing of fluid from the vessel to (i) maintain a substantially constant flow of fluid from the vessel during said dispensing, and (ii) increase fluid flow conductance progressively during said fluid dispensing, to dispense at least 90% of fluid from the vessel at conclusion of said dispensing;    a semiconductor manufacturing tool adapted to use fluid dispensed from said fluid supply system; and    flow circuitry connecting the fluid supply system and the semiconductor manufacturing tool.    
   
   
       23 . A semiconductor manufacturing apparatus according to  claim 22 , wherein the vessel contains a semiconductor manufacturing fluid.  
   
   
       24 . The semiconductor manufacturing apparatus of  claim 23 , wherein the semiconductor manufacturing fluid is selected from the group consisting of hydride gases, halide gases and organometallic source reagent gases.  
   
   
       25 . The semiconductor manufacturing apparatus of  claim 23 , further comprising a gas cabinet having said vessel disposed therein.