Method and apparatus for wafer cleaning

Abstract

An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

1 . A method for processing a wafer, comprising: 
 positioning a wafer onto a bracket;    rotating the bracket at a first speed to dispense a first chemical onto a non-device side and to dispense a second chemical onto a device side of the wafer;    rotating the bracket at a speed slower than the first speed once dispensed;    applying megasonic energy to the wafer non-device side;    rotating the bracket at a speed higher than the first speed to rinse the wafer; and    rotating the bracket at a speed higher than the first speed to dry the wafer.    
   
   
       2 . The method of  claim 1 , wherein the platter is lowered relative to the wafer during the wafer drying operation.  
   
   
       3 . The method of  claim 1 , wherein the first chemical is more dilute than the second chemical.  
   
   
       4 . The method of  claim 1 , wherein the first chemical and the second chemical are discarded after one use.