US2008083436A1PendingUtilityA1

Method and apparatus for wafer cleaning

Assignee: VERHAVERBEKE STEVENPriority: Jun 26, 2000Filed: Oct 26, 2007Published: Apr 10, 2008
Est. expiryJun 26, 2020(expired)· nominal 20-yr term from priority
H10P 70/00H10P 72/0414Y10S134/902B08B 3/02B08B 2203/0288B08B 3/12
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Claims

Abstract

An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.

Claims

exact text as granted — not AI-modified
1 . A wafer holding apparatus, comprising: 
 a bracket capable of rotating about an axis, having at least three points of contact with the wafer; wherein the wafer position is maintained onto the bracket by gravity.    
   
   
       2 . The apparatus of  claim 1 , wherein the bracket is capable of translating along the axis.  
   
   
       3 . The apparatus of  claim 1 , wherein the contact points are pads.  
   
   
       4 . The apparatus of  claim 3 , wherein the pads are an elastomer.  
   
   
       5 . The apparatus of  claim 3 , wherein the pads are positioned on a plurality of posts.

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