US2008083436A1PendingUtilityA1
Method and apparatus for wafer cleaning
Est. expiryJun 26, 2020(expired)· nominal 20-yr term from priority
H10P 70/00H10P 72/0414Y10S134/902B08B 3/02B08B 2203/0288B08B 3/12
55
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Claims
Abstract
An apparatus for wet processing individual wafers comprising; a means for holding the wafer; a means for providing acoustic energy to a non-device side of the wafer; and a means for flowing a fluid onto a device side of the wafer.
Claims
exact text as granted — not AI-modified1 . A wafer holding apparatus, comprising:
a bracket capable of rotating about an axis, having at least three points of contact with the wafer; wherein the wafer position is maintained onto the bracket by gravity.
2 . The apparatus of claim 1 , wherein the bracket is capable of translating along the axis.
3 . The apparatus of claim 1 , wherein the contact points are pads.
4 . The apparatus of claim 3 , wherein the pads are an elastomer.
5 . The apparatus of claim 3 , wherein the pads are positioned on a plurality of posts.Join the waitlist — get patent alerts
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