US2008102278A1PendingUtilityA1
Carbon filament memory and method for fabrication
Est. expiryOct 27, 2026(~0.3 yrs left)· nominal 20-yr term from priority
G11C 2213/35H10B 63/30H10N 70/026H10N 70/023H10N 70/826H10N 70/235H10N 70/8845Y10T428/30
39
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Claims
Abstract
A nonvolatile memory cell is described, including a carbon layer system that includes an sp 2 -rich amorphous carbon layer and an sp 3 -rich amorphous carbon layer, wherein information is stored in the nonvolatile memory cell by reversibly forming an sp 2 -rich filament in the sp 3 -rich amorphous carbon layer.
Claims
exact text as granted — not AI-modified1 . A nonvolatile memory cell comprising:
a carbon layer system that includes an sp 2 -rich amorphous carbon layer and an sp 3 -rich amorphous carbon layer, wherein information can be stored in the nonvolatile memory cell by reversibly forming an sp 2 -rich filament in the sp 3 -rich amorphous carbon layer.
2 . The nonvolatile memory cell of claim 1 , wherein the sp 2 -rich filament changes a conductivity of the carbon layer system.
3 . The nonvolatile memory cell of claim 1 , wherein the sp 3 -rich amorphous carbon layer has a thickness of 5 nm or less.
4 . The nonvolatile memory cell of claim 1 , further comprising a select transistor coupled to the carbon layer system.
5 . The nonvolatile memory cell of claim 1 , wherein the carbon layer system stores multiple bits of information.
6 . The nonvolatile memory cell of claim 5 , wherein different resistance states of the carbon layer system are used to store the multiple bits of information.
7 . The nonvolatile memory cell of claim 1 , wherein application of a first current through the carbon layer system causes growth of the sp 2 -rich filament.
8 . The nonvolatile memory cell of claim 7 , wherein application of a second current, having a reversed polarity with respect to the first current, causes reduction of the sp 2 -rich filament.
9 . The nonvolatile memory cell of claim 1 , wherein the carbon layer system comprises a carbon bi-layer system.
10 . An information storage element, comprising:
a first carbon layer comprising an amorphous carbon film including sp 2 hybridized carbon and sp 3 hybridized carbon, the first carbon layer having a higher proportion of sp 2 hybridized carbon than sp hybridized carbon; and a second carbon layer disposed adjacent to the first carbon layer, the second carbon layer comprising an amorphous carbon film including sp 2 hybridized carbon and sp 3 hybridized carbon, the second carbon layer having a higher proportion of sp 3 hybridized carbon than sp 2 hybridized carbon, wherein information is stored by forcing a first current through the first carbon layer and the second carbon layer to cause growth of a filament in the second carbon layer, the filament having a substantially higher proportion of sp 2 hybridized carbon than sp 3 hybridized carbon.
11 . The information storage element of claim 10 , wherein the filament is reduced by forcing a second current, having a reversed polarity with respect to the first current, through the first carbon layer and the second carbon layer.
12 . The information storage element of claim 10 , wherein the first carbon layer has a resistance R 1 , the second carbon layer has a resistance R 2 , and wherein a ratio R 2 /R 1 is greater than 100 when the filament is absent.
13 . The information storage element of claim 10 , wherein growth of the filament increases a conductivity of the information storage element.
14 . The information storage element of claim 10 , wherein the second carbon layer has a thickness of 5 nm or less.
15 . The information storage element of claim 10 , wherein different resistance states of the information storage element are used to store multiple bits of information in the information storage element.
16 . A nonvolatile memory cell comprising:
a transistor; and a carbon layer system, comprising a first carbon layer, having a first resistance R 1 , and a second carbon layer, having a second resistance R 2 , such a ratio R 2 /R 1 is greater than 100, wherein one of the layers of the carbon layer system is connected to a drain portion of the transistor.
17 . A method for storing information, comprising:
providing a carbon layer system that includes an sp 2 -rich amorphous carbon layer and an sp 3 -rich amorphous carbon layer; and reversibly forming an sp 2 -rich filament in the sp 3 -rich amorphous carbon layer to store the information.
18 . The method of claim 17 , wherein reversibly forming the sp 2 -rich filament comprises applying a first current through the carbon layer system to cause growth of the sp 2 -rich filament.
19 . The method of claim 18 , wherein reversibly forming the sp 2 -rich filament further comprises applying a second current, having a reversed polarity with respect to the first current, to cause reduction of the sp 2 -rich filament.
20 . The method of claim 17 , wherein reversibly forming the sp 2 -rich filament comprises changing a resistance of the carbon layer system.
21 . The method of claim 20 , wherein changing the resistance of the carbon layer system comprises changing the resistance in steps.
22 . The method of claim 21 , wherein changing the resistance in steps further comprises using different steps to represent multiple bits of information.
23 . A method of fabricating a nonvolatile memory device, comprising:
depositing a first carbon layer comprising an amorphous carbon film including sp 2 hybridized carbon and sp hybridized carbon, the first carbon layer having a higher proportion of sp 2 hybridized carbon than sp 3 hybridized carbon; depositing a second carbon layer adjacent to the first carbon layer, the second carbon layer comprising an amorphous carbon film including sp 2 hybridized carbon and sp 3 hybridized carbon, the second carbon layer having a higher proportion of sp 3 hybridized carbon than sp 2 hybridized carbon; and forming contacts that permit a current to be selectively applied through the first carbon layer and second carbon layer.
24 . The method of claim 23 , further comprising forming a transistor having a drain region that is coupled to at least one of the contacts to selectively apply current through the first carbon layer and second carbon layer.
25 . A method of fabricating a nonvolatile memory device, comprising depositing on a semiconductor wafer a carbon layer system comprising a first carbon layer, having a first resistance R 1 , and a second carbon layer, having a second resistance R 2 , such that a ratio R 2 /R 1 is greater than 100.
26 . A computing system comprising:
an input device; an output device; a processor coupled to the input device and the output device; and a nonvolatile memory coupled to the processor, said nonvolatile memory comprising a carbon layer system that includes an sp 2 -rich amorphous carbon layer and an sp 3 -rich amorphous carbon layer, wherein information is stored in the nonvolatile memory by reversibly forming an sp 2 -rich filament in the sp 3 -rich amorphous carbon layer.
27 . The computing system of claim 26 , wherein the output device comprises a wireless communications device.Cited by (0)
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