Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedly

Abstract

A material for an optical circuit-electrical circuit mixedly mounting substrate comprises a light permeable resin layer, and an optical circuit forming layer that is made of a light permeable resin of which refractive index increases (or decreases) when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer, wherein a refractive index of a portion of the optical circuit forming layer is higher (or lower) than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.

1 . A material for an optical circuit-electrical circuit mixedly mounting substrate comprising: 
 a light permeable (or transparent) resin layer, and    an optical circuit forming layer that is made of a light permeable resin of which refractive index increases when irradiated with an activating energy beam and is disposed adjacent to the light permeable resin layer,    wherein a refractive index of a portion of the optical circuit forming layer is higher than that of the light permeable resin layer when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion is irradiated.    
     
     
         2 . The material for the optical circuit-electrical circuit mixedly mounting substrate according to  claim 1  further comprising a second light permeable resin layer, 
 wherein the optical circuit forming layer is disposed between the first light permeable resin layer and the second light permeable resin layer, and    when the activating energy beam is applied to the material for the optical circuit-electrical circuit mixedly mounting substrate so that a portion of the optical circuit forming layer is irradiated with the activating energy beam, a refractive index of said portion of the optical circuit forming layer is higher than that of the second light permeable resin layer.    
     
     
         3 . The material for the optical circuit-electrical circuit mixedly mounting substrate according to  claim 1  wherein it further comprises a metal layer, and the light permeable resin layer is disposed between the metal layer and the optical circuit forming layer.  
     
     
         4 . A material for an optical circuit-electrical circuit mixedly mounting substrate comprising: 
 a metal layer, and    an optical circuit forming layer that is made of a light permeable resin of which refractive index increases when irradiated with an activating energy beam and is disposed adjacent to the metal layer,    wherein the refractive index of a portion of the optical circuit forming layer is higher than that of the rest of the optical circuit forming layer that is not irradiated with the activating energy beam when the material for the optical circuit-electrical circuit mixedly mounting substrate is irradiated with an activating energy beam so that said portion of the optical circuit forming layer is irradiated.    
     
     
         5 . The material for the optical circuit-electrical circuit mixedly mounting substrate according to  claim 3  wherein an adhesive layer is provided adjacent to the metal layer and the adhesive layer is disposed between the metal layer and the optical circuit forming layer.  
     
     
         6 . The material for the optical circuit-electrical circuit mixedly mounting substrate according to  claim 3  further comprising a supporting member, wherein the supporting member constituting an exposed surface of the material for the optical circuit-electrical circuit mixedly mounting substrate on the side thereof nearer to the metal layer.  
     
     
         7 . The material for the optical circuit-electrical circuit mixedly mounting substrate according to  claim 3  further comprising a cover film, wherein the cover film constituting a surface of the material for the optical circuit-electrical circuit mixedly mounting substrate on the side thereof farther from the metal layer.