Inventor · disambiguated record
Tomoaki Nemoto
Also filed as: NEMOTO TOMOAKI
7 granted patents·6 pending applications·103 citations·filing 2003–2023
85Inventor score
Top patents by PatentIndex Score
13 records- 0187US7057277B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 6, 2006·53 cites·22 claims
- 0282US7330612B2Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedlyMATSUSHITA ELECTRIC WORKS LTD·Filed 2003·Granted Feb 12, 2008·24 cites·4 claims
- 0368US9085200B2Pneumatic tireOCHI NAOYA·Filed 2009·Granted Jul 21, 2015·2 cites·1 claims
- 0466US7061103B2Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 13, 2006·14 cites·16 claims
- 0563US2025283855A1Road surface condition determination device and control deviceBRIDGESTONE CORP·Filed 2023·Application pending·0 cites
- 0662US8627864B2Pneumatic tire with tread having lug grooves and sub-groovesOCHI NAOYA·Filed 2009·Granted Jan 14, 2014·1 cites·4 claims
- 0759US7230331B2Chip package structure and process for fabricating the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jun 12, 2007·8 cites·5 claims
- 0855US8073295B2Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedlyNAKASHIBA TOORU·Filed 2007·Granted Dec 6, 2011·1 cites·18 claims
- 0948US2008107881A1Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedlyMATSUSHITA ELECTRIC WORKS LTD·Filed 2007·Application pending·0 cites
- 1048US2008113168A1Material for substrate mounting optical circuit-electrical circuit mixedly and substrate mounting optical circuit-electrical circuit mixedlyMATSUSHITA ELECTRIC WORKS LTD·Filed 2007·Application pending·0 cites
- 1146US2006261499A1Chip package structureMATSUSHITA ELECTRIC WORKS LTD·Filed 2006·Application pending·0 cites
- 1245US2007072339A1Process for fabricating chip package structureCHEN KAI-CHI·Filed 2006·Application pending·0 cites
- 1338US2004212080A1[chip package structure and process for fabricating the same]Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →