Apparatus and process for precise encapsulation of flip chip interconnects

Abstract

A method for encapsulating flip chip interconnects includes applying a limited quantity of encapsulating resin to the interconnect side of an integrated circuit chip, and thereafter bringing the chip together with a substrate under conditions that promote the bonding of bumps on the interconnect side of the chip with bonding pads on the substrate. In some embodiments, the step of applying resin to the chip includes dipping the interconnect side of the chip to a predetermined depth in a pool of resin, and then withdrawing the chip from the resin pool. In some embodiments the step of applying resin to the chip includes providing a reservoir having a bottom, providing a pool of resin in the reservoir to a shallow depth over the reservoir bottom, dipping the chip into the resin pool so that the bumps contact the reservoir bottom, and then withdrawing the chip from the resin pool. Also, apparatus for applying a precise volume of encapsulating resin to a chip, includes a reservoir having a bottom, and means for dispensing a pool of encapsulating resin to a predetermined depth over the reservoir bottom.

1 - 4 . (canceled) 
   
   
       5 . A semiconductor device manufacturing tool for applying encapsulating resin to an area of the semiconductor device, comprising:
 a semiconductor device support tool;   a semiconductor device having a plurality of interconnect bumps formed on a first surface of the semiconductor device, the interconnect bumps having a standoff height as measured from a distal end of the interconnect bumps to the first surface, the semiconductor device further having a second surface opposite the first surface, the second surface of the semiconductor device being attached to the semiconductor device support tool;   a support structure having a recessed area defining a reservoir which contains the encapsulating resin, the reservoir having a depth not greater than the standoff height of the interconnect bumps, wherein the interconnect bumps of the semiconductor device are dipped into the reservoir so the distal ends of the interconnect bumps contact a bottom of the reservoir and the encapsulating resin is deposited on the interconnect bumps and first surface of the semiconductor device; and   a substrate having interconnect pads on a surface, the semiconductor device support tool positioning the semiconductor device so that the interconnect bumps on the semiconductor device contact the interconnect pads of the substrate, wherein the encapsulating resin deposited on the first surface of the semiconductor device is transferred to the surface of the substrate in proper quantity to encapsulate an area between the semiconductor device and substrate without excessive bleed out of the encapsulating resin.   
   
   
       6 . The semiconductor device manufacturing tool of  claim 5 , wherein the depth of the reservoir is less than the standoff height of the interconnect bumps. 
   
   
       7 . The semiconductor device manufacturing tool of  claim 5 , wherein the semiconductor device is a flip chip semiconductor device. 
   
   
       8 . The semiconductor device manufacturing tool of  claim 5 , wherein the semiconductor device and substrate are aligned prior to contacting the interconnect bumps to the interconnect pads. 
   
   
       9 . The semiconductor device manufacturing tool of  claim 5 , wherein a quantity of encapsulating resin deposited on the first surface of the semiconductor device by dipping the interconnect bumps into the reservoir is determined by a depth of encapsulating resin in the reservoir. 
   
   
       10 . The semiconductor device manufacturing tool of  claim 5 , wherein the encapsulating resin forms a fillet around a perimeter of the semiconductor device. 
   
   
       11 . An apparatus for applying encapsulating resin to an area of the semiconductor device, comprising:
 a semiconductor device having a plurality of interconnect bumps formed on a first surface of the semiconductor device, the interconnect bumps having a standoff height as measured from a distal end of the interconnect bump to the first surface;   a support structure having a recessed area defining a reservoir which contains the encapsulating resin, the reservoir having a depth not greater than the standoff height of the interconnect bumps, wherein the interconnect bumps of the semiconductor device are dipped into the reservoir so the distal ends of the interconnect bumps contact a bottom of the reservoir and the encapsulating resin is deposited on the interconnect bumps and first surface of the semiconductor device; and   a substrate having interconnect pads on a surface, the interconnect bumps of the semiconductor device contacting the interconnect pads of the substrate so that the encapsulating resin deposited on the first surface of the semiconductor device is transferred to the surface of the substrate in proper quantity to encapsulate an area between the semiconductor device and substrate without excessive bleed out of the encapsulating resin.   
   
   
       12 . The apparatus of  claim 11 , wherein the depth of the reservoir is less than the standoff height of the interconnect bumps. 
   
   
       13 . The apparatus of  claim 11 , wherein the semiconductor device is a flip chip semiconductor device. 
   
   
       14 . The apparatus of  claim 11 , wherein the semiconductor device and substrate are aligned prior to contacting the interconnect bumps to the interconnect pads. 
   
   
       15 . The apparatus of  claim 11 , wherein a quantity of encapsulating resin deposited on the first surface of the semiconductor device by dipping the interconnect bumps into the reservoir is determined by a depth of the encapsulating resin in the reservoir. 
   
   
       16 . The apparatus of  claim 11 , wherein the encapsulating resin forms a fillet around a perimeter of the semiconductor device. 
   
   
       17 . An apparatus for applying encapsulating resin to an area of the semiconductor device, comprising:
 a semiconductor device having a plurality of interconnect bumps formed on a first surface of the semiconductor device, the interconnect bumps having a standoff height as measured from a distal end of the interconnect bumps to the first surface;   a support structure having a recessed area defining a reservoir which contains the encapsulating resin, the reservoir having a depth not greater than the standoff height of the interconnect bumps, wherein the interconnect bumps of the semiconductor device are dipped into the reservoir so the distal ends of the interconnect bumps contact a bottom of the reservoir and the encapsulating resin is deposited on the interconnect bumps; and   a substrate having interconnect pads on a surface, the interconnect bumps of the semiconductor device contacting the interconnect pads of the substrate so that the encapsulating resin deposited on the interconnect bumps of the semiconductor device is transferred to the surface of the substrate to encapsulate an area between the semiconductor device and substrate.   
   
   
       18 . The apparatus of  claim 17 , wherein the depth of the reservoir is less than the standoff height of the interconnect bumps. 
   
   
       19 . The apparatus of  claim 17 , wherein the semiconductor device is a flip chip semiconductor device. 
   
   
       20 . The apparatus of  claim 17 , wherein the semiconductor device and substrate are aligned prior to contacting the interconnect bumps to the interconnect pads. 
   
   
       21 . The apparatus of  claim 17 , wherein a quantity of encapsulating resin deposited on the first surface of the semiconductor device by dipping the interconnect bumps into the reservoir is determined by a depth of encapsulating resin in the reservoir. 
   
   
       22 . The apparatus of  claim 17 , wherein the encapsulating resin forms a fillet around a perimeter of the semiconductor device.