Porous composition of matter, and method of making same

Abstract

A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.

1 . A method of forming a porous material comprising:
 applying a composition of matter having a vitrification temperature (Tv-comp) onto a surface of a substrate, said composition of matter comprising a b-staged thermosetting resin having a vitrification temperature (Tv-resin), a pore generating material, and a reactive additive selected to lower the Tv-comp below that of the Tv-resin;   heating the composition of matter to vitrify the resin and the reactive additive; and   decomposing the pore generating material providing a porous layer of cured material on the surface of the substrate.   
   
   
       2 . The method of  claim 1  wherein said decomposing comprises heating. 
   
   
       3 . The method of  claim 1  wherein said decomposing comprises radiation treatment. 
   
   
       4 . The method of  claim 1  wherein said composition of matter further comprises a solvent. 
   
   
       5 . The method of  claim 1  wherein said reactive additive is selected to increase solubility of said pore generating material 
   
   
       6 . The method of  claim 1  wherein:
 the b-staged thermosetting resin comprises a polyarylene material;   the pore generating material comprises a thermally labile polymer material; and   the reactive additive comprises a triacetylene material that includes a centrally located uniformly 1,3,5-trisubstituted phenyl moiety.   
   
   
       7 . The method of  claim 1  wherein the substrate includes an interconnect structure. 
   
   
       8 . An interconnect structure comprising at least a porous low-k dielectric material which comprises a vitrified and decomposed composition of matter having a vitrification temperature (Tv-comp), said composition of matter comprising a b-staged thermosetting resin having a vitrification temperature (Tv-resin), a pore generating material, and a reactive additive selected to lower the Tv-comp below that of the Tv-resin 
   
   
       9 . The interconnect structure of  claim 8  wherein said porous low-k dielectric material has stable and nano-sized pores. 
   
   
       10 . The interconnect structure of  claim 8  wherein said porous low-k dielectric has a dielectric constant of less than about 3.9. 
   
   
       11 . The interconnect structure of  claim 8  further comprising an underlying substrate selected from the group consisting of a semiconducting material, an insulating material, a conductive material, and multilayers thereof. 
   
   
       12 . The interconnect structure of  claim 8  wherein:
 the b-staged thermosetting resin comprises a polyarylene material;   the pore generating material comprises a thermally labile polymer material; and   the reactive additive comprises a triacetylene material that includes a centrally located uniformly 1,3,5-trisubstituted phenyl moiety.   
   
   
       13 . The interconnect structure of  claim 8  wherein the vitrified and decomposed composition of matter results from the method of  claim 1 .